Eid, E.A., Fouda, A.N. and Duraia, E.-S.M. (2016) Effect of Adding 0.5 wt% ZnO Nanoparticles, Temperature and Strain Rate on Tensile Properties of Sn-5.0 wt% Sb-0.5 wt% Cu (SSC505) Lead Free Solder Alloy. Materials Science and Engineering: A, 657, 104-114.
https://doi.org/10.1016/j.msea.2016.01.081

has been cited by the following article:

• TITLE: Enhancing the Creep Resistance of Sn-9.0Zn-0.5Al Lead-Free Solder Alloy by Small Additions of Sb Element

  AUTHORS: E. A. Eid, Manal A. Ramadan, A. B. El Basaty

  KEYWORDS: Sn-Zn-Al-Sb Alloys, Lead Free Solders, Sb Addition, Creep Properties

  JOURNAL NAME: Engineering, Vol.10 No.1, January 31, 2018

  ABSTRACT: The creep phenomenon is considered as one of the most important deformation mechanisms under working conditions. The present study has examined the microstructure and creep properties of Sn-9.0Zn-0.5Al solder alloy after adding a small amount of Antimony (Sb). Nominal compositions of Sb additions were chosen to be 0, 0.5, 1.0, and 1.5 wt.%. The minimum strain rate was reduced for the Sb containing solder alloy. The stress exponents, n, were found to be around 3.7 for all soldiers at 130°C. The stress exponent increases as the temperature drops from 100°C to 50°C, except for the 1.0% Sb alloy, where n 5.3 - 6.1 at all the temperature range (T = 50°C, 100°C and 130°C). The results reveal that the Sb-containing solder alloys have better creep resistance with greater ductility than the Sb-free alloy due to solid solution strengthening, and intermetallic compound SnSb particle hardening.