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X. L. Xie, Y. L. He, W. Q Tao and H. W. Yang, “An Experimental Investigation on a Novel High-Performance Integrated Heat Pipe—Heat Sink for High-Flux Chip Cooling,” Applied Thermal Engineering, Vol. 28, 2008, pp. 433-439. UUU-doi:10.1016/j.applthermaleng.2007.05.010UUU
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