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Wong, S.-C. and Lin, Y.-C. (2011) Effect of Copper Surface Wettability on the Evaporation Performance: Tests in a Flat-Plate Heat Pipe with Visualization. International Journal of Heat and Mass Transfer, 54, 3921-3926.
http://dx.doi.org/10.1016/j.ijheatmasstransfer.2011.04.033

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