Article citationsMore>>

Koetter, T.G., Wendrock, H., Schuehrer, H., Wenzel, C. and Wetzig, K. (2000) Relationship between Microstructure and Electromigration Damage in Unpassivated PVD Copper Damascene Interconnects. Microelectronics Reliability, 40, 1295-1299.
http://dx.doi.org/10.1016/S0026-2714(00)00140-2

has been cited by the following article:

Follow SCIRP
Twitter Facebook Linkedin Weibo
Contact us
+1 323-425-8868
customer@scirp.org
WhatsApp +86 18163351462(WhatsApp)
Click here to send a message to me 1655362766
Paper Publishing WeChat
Free SCIRP Newsletters
Copyright © 2006-2024 Scientific Research Publishing Inc. All Rights Reserved.
Top