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Yoshino, H., Fujii, M., Zhang, X. and Behnia, M. (2003) Numerical Simulation of Conjugate Heat Transfer from Multiple Electronic Module Packages Cooled by Air. IPACK 2003-35144, 331-336. ASME 2003 International Electronic Packaging Technical Conference and Exhibition 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, Maui, 6-11 July 2003.

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