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Koetter, T.G., Wendrock, H., Schuehrer, H., Wenzel, C. and Wetzig, K. (2000) Relationship between Microstructure and Electromigration Damage in Unpassivated PVD Copper Damascene Interconnects. Microelectronics Reliability, 40, 1295-1299.
http://dx.doi.org/10.1016/S0026-2714(00)00140-2

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