EBSD Analysis of the Submicron Width Fibber Shaped Grain Copper Fabricated by Drawing
Masafumi Matsushita, Tomoya Kuji, Hiromitsu Kuroda, Seigi Aoyama, Hiroaki Ohfuji
DOI: 10.4236/msa.2011.27121   PDF    HTML     5,424 Downloads   8,696 Views   Citations


Several drawing processes of 3N pure copper (Cu) with ultra high reduction in area have been performed, and the texture has been observed using electron back scattered diffraction. It is well known that the texture of drawn Cu is closely related to its mechanical properties; in particular nanometer scale width fibber shaped grain is interesting. Previously, it was reported that drawing 3N Cu with around 95% reduction in area changes its mechanical properties. In the present experiment, grains have been changed from round to fiber-shaped, and subsequently, submicron-width fiber grains were generated with a 94.546% reduction in area. However, above 94.546% reduction in area, dynamic recrystallization occurred and then, prevented the grains to be finer. Further recrystallized grains influence on the macroscopic mechanical properties of Cu wire. Furthermore, the distribution of the misorientation angle at grain boundaries increased with an increase in the degree of reduction in area; in particular, the distribution drastically increased between 94.546% and 99.997%. Further, the frequency of coincidence of site lattice boundaries increased. The abovementioned variations in texture are closely related to mechanical properties.

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M. Matsushita, T. Kuji, H. Kuroda, S. Aoyama and H. Ohfuji, "EBSD Analysis of the Submicron Width Fibber Shaped Grain Copper Fabricated by Drawing," Materials Sciences and Applications, Vol. 2 No. 7, 2011, pp. 911-916. doi: 10.4236/msa.2011.27121.

Conflicts of Interest

The authors declare no conflicts of interest.


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