Development of a High-PerformanceFlexible Substrate for Flexible Electronics:Joining TAC Films and an Ultra-Thin Glassby Using TEOS-DAC Synthesized by the Sol-Gel Method


A new flexible substrate for flexible electronics has been developed. The developed substrate consists of an ultra thin glass and TAC (triacethyl cellulose) film. An ultra thin glass and TAC film were joined with TEOS-DAC (TEOS: tetraethyl orthosilicate, DAC: diacethy cellulose) adhesive resin synthesized by sol-gel method by means of thermo-compression bonding. This substrate has high transparency in visible-light region (90%), high flexibility (torsion strength and bending strength) and high gas barrier characteristics due to an ultra thin glass. The newly-developed substrate is superior to the substrates fabricated with commercially available adhesive resin in the same way in characteristics of heat resistance, transparency and flexibility.

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Ohishi, T. , Kawada, H. , Yoshida, T. and Ohwada, T. (2015) Development of a High-PerformanceFlexible Substrate for Flexible Electronics:Joining TAC Films and an Ultra-Thin Glassby Using TEOS-DAC Synthesized by the Sol-Gel Method. Materials Sciences and Applications, 6, 1100-1110. doi: 10.4236/msa.2015.612109.

Conflicts of Interest

The authors declare no conflicts of interest.


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