A Study of the Replacement of Materials in Smart Card


Gold, nickel and copper are usually used in connector of the smart card. Since Au is expensive and Ni is an allergenic material, simulated (CES) and bibliographical work is carried out in order to replace the Au and Ni layer in smart card connectors without sacrificing reliability. During the work, mechanical and electrical properties, corrosion resistance, cost, toxicity and process compatibility of the samples have been taken into consideration. Cu alloying with Zn or Sn, Cr and stainless steel were selected for electrodeposition process. Secondly, carbides (WC, TiC, ZrC), Ti, TiN, borides (TiB2) and silicide (MoSi2) are considered as a vapour deposited materials and some Cu alloying with Al, N or Mg also considered via ion implantation processes. But, vapour deposition and implantation are high energy processes compared to the electrodeposition process, which is expensive. Therefore, electrodeposited materials such as, Cu alloys (Brass or bronze), Cr and stainless steel could be considered as promising candidate to replace the Au and Ni layer in smart card connectors.

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Rahma, M. , Marchand, R. and Neher, B. (2015) A Study of the Replacement of Materials in Smart Card. Materials Sciences and Applications, 6, 773-782. doi: 10.4236/msa.2015.69079.

Conflicts of Interest

The authors declare no conflicts of interest.


[1] Knoll, B.T. (2007) Smart Card. U.S. Patent No. 7213769B2.
[2] About Smart Cards (2014) Introduction: Market Information.
[3] Rankl, W. and Effing, W. (1997) Smart Card Handbook. John Willey & Sons, Chichester.
[4] Richard, E. (2006) Microsoft PowerPoint-DS-006. Smartcard Substrate Datasheet Review [Online].
[5] Ashby, M., Shercliff, H. and Cebon, D. (2007) Materials: Engineering, Science, Processing and Design. Elsevier, Oxford.
[6] Bausson, S. (1995) ISO7816 Asynchronous Smartcard Information [Online].
[7] Lee, K.Y., Jeong, D.K. and Kim, J.H. (2011) Simulational Study of Electrical Contact Degradation under Fretting Corrosion. Tribology International, 44, 1651-1658.
[8] Lalanne, P. (2006) Utilisation du bronze blanc sur les produits portés externs. Matériaux & Techniques, 94, 39-45.
[9] Ding, P.J., Lanford, W.A., Hymes, S. and Murarka, S.P. (1994) Oxidation Resistant High Conductivity Copper Films. Applied Physics Letters, 64, 2897-2899.
[10] An, Q.Z., Li, L.H., Hu, T., Xin, Y.C., Fu, R.K.Y., Kwok, D.T.K., Cai, X. and Chu, P.K. (2009) Comparison of Oxidation Resistance of Copper Treated by Beam-Line Ion Implantation and Plasma Immersion Ion Implantation. Materials Chemistry and Physics, 16, 519-522.
[11] Ding, P.J., Wang, W., Lanford, W.A., Hymes, S. and Murarka, S.P. (1994) Investigation of the Mechanism Responsible for the Corrosion Resistance of B Implanted Copper. Nuclear Instruments and Methods in Physics Research, 85, 260-263.
[12] Zhao, X.Q., Han, Y.F. and Liu, B.X. (2001) Modification of Oxidation Resistance of Copper Films by Shallow Implantation. Journal of Applied Physics, 90, 1638-1641.
[13] DePoto, R.E., Grunewald, A., Weber, J. and Leyendecker, K. (2013) White Bronze, Copper-Tin-Zinc Tri-Metal: Expanding Applications and New Developments in a Changing Landscape, Products Finishing.
[14] Evans, C. (1980) Connector Finishes: Tin in Place of Gold. IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 3, 226-232.
[15] Rudolphi, A.K. and Jacobson, S. (1997) Stationary Loading, Fretting and Sliding of Silver Coated Copper Contact— Influence of Corrosion Films and Corrosive Atmosphere. Tribology International, 30, 165-175.
[16] Mandich, N.V. and Snyder, D.L. (2010) Electrodeposition of Chromium, Modern Electroplating. John Willey & Sons, Hoboken.
[17] Izaki, M. (2010) Electrodeposition of Iron and Iron Alloys, Modern Electroplating. John Willey & Sons, Hoboken, 309-326.
[18] Schlesinger, M. and Paunovic, M. (2010) Modern Electroplating. John Willey & Sons, Hoboken.
[19] Snyder, N.V., Dans, M.P. and Schlesinger, M. (2010) Electro Deposition of Chromium: Modern Electroplating. John Willey & Sons, Hoboken, 205-248.

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