Modeling and Optimization of Electrical Discharge Machining of SiC Parameters, Using Neural Network and Non-Dominating Sorting Genetic Algorithm (NSGA II)

Ramezan Ali MahdaviNejad

doi:10.4236/msa.2011.26092

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Materials Sciences and Applications > Vol.2 No.6, June 2011

Modeling and Optimization of Electrical Discharge Machining of SiC Parameters, Using Neural Network and Non-Dominating Sorting Genetic Algorithm (NSGA II) ()

Ramezan Ali MahdaviNejad

DOI: 10.4236/msa.2011.26092 PDF HTML 6,204 Downloads 12,470 Views Citations

Abstract

Silicon Carbide (SiC) machining by traditional methods with regards to its high hardness is not possible. Electro Discharge Machining, among non-traditional machining methods, is used for machining of SiC. The present work is aimed to optimize the surface roughness and material removal rate of electro discharge machining of SiC parameters simultaneously. As the output parameters are conflicting in nature, so there is no single combination of machining parameters, which provides the best machining performance. Artificial neural network (ANN) with back propagation algorithm is used to model the process. A multi-objective optimization method, non-dominating sorting genetic algorithm-II is used to optimize the process. Affects of three important input parameters of process viz., discharge current, pulse on time (T_on), pulse off time (T_off) on electric discharge machining of SiC are considered. Experiments have been conducted over a wide range of considered input parameters for training and verification of the model. Testing results demonstrate that the model is suitable for predicting the response parameters. A pareto-optimal set has been predicted in this work.

Keywords

Electro Discharge Machining, Non-Dominating Sorting Algorithm, Neural Network, REFEL SiC

Share and Cite:

R. MahdaviNejad, "Modeling and Optimization of Electrical Discharge Machining of SiC Parameters, Using Neural Network and Non-Dominating Sorting Genetic Algorithm (NSGA II)," Materials Sciences and Applications, Vol. 2 No. 6, 2011, pp. 669-675. doi: 10.4236/msa.2011.26092.

Conflicts of Interest

The authors declare no conflicts of interest.

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