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Simplified Model of a Layer of Interconnects under a Spiral Inductor

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DOI: 10.4236/jemaa.2011.36031    6,346 Downloads   10,131 Views   Citations

ABSTRACT

An empirical effective medium approximation that provides a homogeneous equivalent for a layer of interconnects un-derneath a spiral inductor is presented. When used as part of a numerical 3D model of the inductor, this approach yields a faster simulation that uses less memory, yet still predicts the quality factor and inductance to within 1%. We expect this technique to find use in the electromagnetic modeling of System-on-Chip.

Conflicts of Interest

The authors declare no conflicts of interest.

Cite this paper

S. Holik and T. Drysdale, "Simplified Model of a Layer of Interconnects under a Spiral Inductor," Journal of Electromagnetic Analysis and Applications, Vol. 3 No. 6, 2011, pp. 187-190. doi: 10.4236/jemaa.2011.36031.

References

[1] J. Choi, M. Swaminathan, B. Beker and R. Master, “Modeling of Realistic On-Chip Power Grid Using FDTD method,” IEEE International Symposium Electromagnetic Compatibility, Vol. 1, 2002, pp. 238-243.
[2] Fontanelli, “System-in-Package Technology: Opportunities and Challenges,” IEEE 9th International Symposium on Quality Electronic Design, 2008, pp. 589-593.
[3] S. M. Holik and T. D. Drysdale, “Effective Medium Approximation for Electromagnetic Compatibility Analysis of Integrated Circuits,” Proceedings 2nd International Congress on Advanced Electromagnetic Materials in Microwaves and Optics, 2008, pp. 413-415.
[4] S. M. Holik and T. D. Drysdale, “Simplified Model for On-Chip Interconnects in Electromagnetic Modelling of System-in-Package,” Proceedings 12th International Conference on Electromagnetics in Advanced Applications, 2010, pp. 541-544.
[5] J. H. Chang, Y. S. Youn, H. K. Yu, and C. K. Kim, “Effects of dummy patterns and substrate on spiral inductors for sub-micron RF ICs,” IEEE Radio Frequency Integrated Circuits Symposium, 2-4 June 2002, pp. 419-422. doi:10.1109/RFIC.2002.1012081
[6] C. L. Chen, “Effects of CMOS Process Fill Patterns on Spiral Inductors,” Microwave and Optical Technology Letters, Vol. 36, No. 6, 2003, pp. 462-465. doi:10.1002/mop.10790
[7] Ansoft High Frequency Structure Simulator (HFSS), 2010, http://www.ansoft.com/
[8] M. Park, S. Lee, C. S. Kim, K. H. Yu and K. S. Nam, “The Detailed Analysis of High Q CMOS-Compatible Microwave Spiral Inductors in Silicon Technology,” IEEE Transaction Electron Devices, Vol. 45, No. 9, 1998, pp. 1953-1959. doi:10.1109/16.711361
[9] A. H. Sihvola, “Electromagnetic Mixing Formulas and Applications,” IEE Publishing, London, 1999

  
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