A Loop Thermosyphon Type Cooling System for High Heat Flux

Jiwon Yeo; Seiya Yamashita; Mizuki Hayashida; Shigeru Koyama

doi:10.4236/jectc.2014.44014

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Journal of Electronics Cooling and Therm... > Vol.4 No.4, December 2014

A Loop Thermosyphon Type Cooling System for High Heat Flux ()

Jiwon Yeo¹, Seiya Yamashita¹, Mizuki Hayashida¹, Shigeru Koyama^2,3*

¹Interdisciplinary Graduate School of Engineering Sciences, Kyushu University, Fukuoka, Japan.
²Faculty of Engineering Sciences, Kyushu University, Fukuoka, Japan.
³International Institute for Carbon-Neutral Energy Research (WPI-I2CNER), Kyushu University, Fukuoka, Japan.

DOI: 10.4236/jectc.2014.44014 PDF HTML XML 3,816 Downloads 4,650 Views Citations

Abstract

With rapid development of the semiconductor technology, more efficient cooling systems for electronic devices are needed. In this situation, in the present study, a loop thermosyphon type cooling system, which is composed mainly of a heating block, an evaporator and an air-cooled condenser, is investigated experimentally in order to evaluate the cooling performance. At first, it is examined that the optimum volume filling rate of this cooling system is approximately 40%. Next, four kinds of working fluids, R1234ze(E), R1234ze(Z), R134a and ethanol, are tested using a blasted heat transfer surface of the evaporator. In cases of R1234ze(E), R1234ze(Z), R134a and ethanol, the effective heat flux, at which the heating block surface temperature reaches 70°C, is 116 W/cm², 106 W/cm², 104 W/cm² and 60 W/cm², respectively. This result indicates that R1234ze(E) is the most suitable for the present cooling system. The minimum boiling thermal resistance of R1234ze(E) is 0.05 (cm²·K)/W around the effective heat flux of 100 W/cm². Finally, four kinds of heat transfer surfaces of the evaporator, smooth, blasted, copper-plated and finned surfaces, are tested using R1234ze(E) as working fluid. The boiling thermal resistance of the blasted surface is the smallest among tested heat transfer surfaces up to 116 W/cm² in effective heat flux. However, it increases drastically due to the appearance of dry-patch if the effective heat flux exceeds 116 W/cm². On the other hand, in cases of copper-plated and finned surfaces, the dry-patch does not appear up to 150 W/cm² in effective heat flux, and the boiling thermal resistances of those surfaces keep 0.1 (cm²·K)/W.

Keywords

Cooling, Boiling, Loop Thermosyphon, Grobal Warming Potential, Thermal Resistance

Share and Cite:

Yeo, J. , Yamashita, S. , Hayashida, M. and Koyama, S. (2014) A Loop Thermosyphon Type Cooling System for High Heat Flux. Journal of Electronics Cooling and Thermal Control, 4, 128-137. doi: 10.4236/jectc.2014.44014.

Conflicts of Interest

The authors declare no conflicts of interest.

References

[1]	Mudawar, I. (2001) Assessment of High-Heat-Flux Thermal Management Schemes. IEEE Transactions on Components and Packaging Technologies, 24, 122-141. http://dx.doi.org/10.1109/6144.926375
[2]	Webb, R.L., Yamauchi, S., Denko, S. and Tochigi, K.K. (2002) Remote Heat Sink Concept for High Power Heat Rejection. IEEE Transactions on Components and Packaging Technologies, 25, 608-614. http://dx.doi.org/10.1109/TCAPT.2003.809109
[3]	Gima, S., Nagata, T., Zhang, X. and Fujii, M. (2005) Experimental Study on CPU Cooling System of Closed-Loop Two-Phase Thermosyphon. Heat Transfer—Asian Research, 34, 147-159. http://dx.doi.org/10.1002/htj.20057
[4]	Kawaguchi, K., Terao, T. and Matsumoto, T. (2006) Cooling Unit for Computer Chip by Using Boiling Heat Transfer (Evaluation of Basic Cooling Performance and Simulation for Predicting Cooling Performance). Transactions of the Japan Society of Mechanical Engineers, 72, 4-11.
[5]	Matsushima, H. and Usui, R. (2013) Heat Transfer Characteristics of Thermosiphon Type Heat Pipe Using Surfactant Aqueous Solution as Working Fluid. Thermal Science and Engineering, 21, 95-103.
[6]	Chan, M.A., Yap, C.R. and Ng, K.C. (2009) Modeling and Testing of an Advanced Compact Two-Phase Cooler for Electronics Cooling. International Journal of Heat and Mass Transfer, 52, 3456-3463. http://dx.doi.org/10.1016/j.ijheatmasstransfer.2009.02.044
[7]	Parker, J.L. and El-Genk, M.S. (2005) Enhanced Saturation and Subcooled Boiling of FC-72 Dielectric Liquid. International Journal of Heat and Mass Transfer, 48, 3736-3752. http://dx.doi.org/10.1016/j.ijheatmasstransfer.2005.03.011
[8]	Mori, S. and Okuyama, K. (2009) Enhancement of the Critical Heat Flux in Saturated Pool Boiling Using Honeycomb Porous Media. International Journal of Multiphase Flow, 35, 946-951. http://dx.doi.org/10.1016/j.ijmultiphaseflow.2009.05.003
[9]	Saiz Jabardo, J.M. (2010) An Overview of Surface Roughness Effects on Nucleate Boiling Heat Transfer. The Open Transport Phenomena Journal, 2, 24-34. http://dx.doi.org/10.2174/1877729501002010024
[10]	El-Genk, M.S. and Ali, A.F. (2010) Enhanced Nucleate Boiling on Copper Micro-Porous Surfaces. International Journal of Multiphase Flow, 36, 780-792. http://dx.doi.org/10.1016/j.ijmultiphaseflow.2010.06.003
[11]	Li, C. and Peterson, G.P. (2010) Geometric Effects on Critical Heat Flux on Horizontal Microporous Coatings. Journal of Thermophysics and Heat Transfer, 24, 449-455. http://dx.doi.org/10.2514/1.37619
[12]	Kwark, S.M., Moreno, G., Kumar, R., Moon, H. and You, S.M. (2010) Nanocoating Characterization in Pool Boiling Heat Transfer of Pure Water. International Journal of Heat and Mass Transfer, 53, 4579-4587. http://dx.doi.org/10.1016/j.ijheatmasstransfer.2010.06.035
[13]	Hendricks, T.J., Krishnan, S., Choi, C., Chang, C.H. and Paul, B. (2010) Enhancement of Pool-Boiling Heat Transfer Using Nanostructured Surfaces on Aluminum and Copper. International Journal of Heat and Mass Transfer, 53, 3357-3365. http://dx.doi.org/10.1016/j.ijheatmasstransfer.2010.02.025
[14]	Hosseini, R., Gholaminejad, A. and Jahandar, H. (2011) Roughness Effects on Nucleate Pool Boiling of R-113 on Horizontal Circular Copper Surfaces. World Academy of Science, Engineering and Technology, 5, 541-546.
[15]	Furberg, R. and Palm, B. (2011) Boiling Heat Transfer on a Dendritic and Micro-Porous Surface in R134a and FC-72. Applied Thermal Engineering, 31, 3595-3603. http://dx.doi.org/10.1016/j.applthermaleng.2011.07.027
[16]	Jun, S., Sinha-Ray, S. and Yarin, A.L. (2013) Pool Boiling on Nano-Textured Surfaces. International Journal of Heat and Mass Transfer, 62, 99-111. http://dx.doi.org/10.1016/j.ijheatmasstransfer.2013.02.046
[17]	McHale, J.P. and Garimella, S.V. (2013) Nucleate Boiling from Smooth and Rough Surfaces—Part 1: Fabrication and Characterization of an Optically Transparent Heater-Sensor Substrate with Controlled Surface Roughness. Experimental Thermal and Fluid Science, 44, 456-467. http://dx.doi.org/10.1016/j.expthermflusci.2012.08.006
[18]	McHale, J.P. and Garimella, S.V. (2013) Nucleate Boiling from Smooth and Rough Surfaces—Part 2: Analysis of Surface Roughness Effects on Nucleate Boiling. Experimental Thermal and Fluid Science, 44, 439-455. http://dx.doi.org/10.1016/j.expthermflusci.2012.08.005