[1]
|
G. M. Grover, “US Patent No. 3229759,” 1963.
|
[2]
|
G. P. Peterson, “An Introduction to Heat Pipe—Mode- ling, Testing, and Applications,” John Wiley & Sons Inc., New York, 1994.
|
[3]
|
Y. Wang and G. P. Peterson, “Investi-gation of a Novel Flat Heat Pipe,” Journal of Heat Transfer, Vol. 127, No. 2, 2005, pp. 165-170. UUU-doi:10.1115/1.1842789UUU
|
[4]
|
A. Faghri, “Heat Pipe Science and Technology,” Taylor and Francis Ltd., Washington DC, 1995.
|
[5]
|
V. G. Rajesha and K. P. Ra-vindrana, “Optimum Heat Pipe Design: A Nonlinear Pro-gramming Approach,” International Communications in Heat and Mass Transfer, Vol. 24, No. 3, 1997, pp. 371-380.
UUUdoi:10.1016/S0735-1933(97)00022-5UUU
|
[6]
|
F. Lefevre and M. Lallemand, “Coupled Thermal and Hy-drodynamic Models of Flat Micro Heat Pipes for the Cooling of Multiple Electronic Components,” Interna-tional Journal of Heat and Mass Transfer, Vol. 49, No. 7-8, 2006, pp. 1375-1383.
UUU-doi:10.1016/j.ijheatmasstransfer.2005.10.001UUU
|
[7]
|
G. P. Peterson and L. S. Fletcher, “Effective Thermal Conductivity of Sintered Heat Pipe Wicks,” Journal of Thermophysics, Vol. 1, No. 4, 1987, pp.343-347.
UUUdoi:10.2514/3.50UUU
|
[8]
|
G. Mohamed, L. M. Hung and J. M. Tournier, “Transient Experiments of an Inclined Copper Water Heat Pipe,” Journal of Thermo-physics and Heat Transfer, Vol. 9, No. 1, 1995, pp.109-116.
|
[9]
|
X. L. Xie, Y. L. He, W. Q Tao and H. W. Yang, “An Experimental Investigation on a Novel High-Performance Integrated Heat Pipe—Heat Sink for High-Flux Chip Cooling,” Applied Thermal Engineering, Vol. 28, 2008, pp. 433-439. UUU-doi:10.1016/j.applthermaleng.2007.05.010UUU
|
[10]
|
D. A. Beson and C. V. Robino, “Design and Testing of Metal and Silicon Heat Spreaders with Embedded Microma-chined Heat Pipes,” American Society of Mechanical En-gineers, Vol. 26, 1999, pp. 2-8.
|
[11]
|
N. J. Gernert, J. Toth and J. Hartenstine, “100 W/cm2 and Higher Heat Flux Dissipation Using Heat Pipes,” 13th In- ternational Heat Pipe Conference, 21-25 September 2004, Shanghai, pp. 256-262.
|
[12]
|
J.-C. Wang, “Superposition Method to Investigate the Thermal Performance of Heat Sink with Embedded Heat Pipes,” International Communication in Heat and Mass Transfer, Vol. 36, No. 7, 2009, pp. 686-692.
UUU-doi:10.1016/j.icheatmasstransfer.2009.04.008UUU
|
[13]
|
J.-C. Wang, R.-T. Wang, C.-C. Chang and C.-L. Huang, “Program for Rapid Computation of the Thermal Perfor-mance of a Heat Sink with Embedded Heat Pipes,” Jour-nal of the Chinese Society of Mechanical Engineers, Vol. 31, No. 1, 2010, pp. 21-28.
|
[14]
|
J.-C. Wang, “L-Type Heat Pipes Application in Electronic Cooling System,” International Journal of Thermal Sciences, Vol. 50, No. 1, 2011, pp.97-105.
UUUdoi:10.1016/j.ijthermalsci.2010.07.001UUU
|
[15]
|
W. H. Huang, “Fabrication and Performance Testing of Sintered Miniature Heat Pipe,” M. E. Master Thesis, National Taiwan University, Taiwan, 2000.
|
[16]
|
20 December 2010. http://www.crtech.com/
|