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Study of Ni/Al Interface Diffusion by Molecular Dynamics Simulation

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DOI: 10.4236/eng.2011.33026    4,497 Downloads   8,313 Views   Citations

ABSTRACT

Molecular dynamics simulation of Ni/Al interface diffusion is carried out by Embedded Atom Method (EAM) potential. The problem how the temperature affects Ni/Al interface diffusion is discussed. The initial dynamic behavior of Ni/Al interface diffusion at high temperature is shown. The study in this letter is helpful to understand the origin of diffusion phenomenon.

Conflicts of Interest

The authors declare no conflicts of interest.

Cite this paper

C. Zhang, H. Wang and Y. Qiu, "Study of Ni/Al Interface Diffusion by Molecular Dynamics Simulation," Engineering, Vol. 3 No. 3, 2011, pp. 227-232. doi: 10.4236/eng.2011.33026.

References

[1] J. Qi and Y. Song, “Experimental Studies on the Diffusion Reaction of Al /Ni /Fe Interface,” Metal Materials and Metallurgy Engineering, Vol. 35, No. 6, 2007, pp. 8-11.
[2] Y. Song, S. Li and G. Du, “Forming Rule of Ti/Cu Interphase Diffusion Solution Zone,” Rare Metal Materials and Engineering, Vol. 38, No. 7, 2009, pp. 1188-1192.
[3] M. Liu, J. Zhang and K.Xu, “Interface Diffusion and Resistivity of Ni/Al Nanomultilayers,” Acta Metallurgica Sinica, Vol. 44, No. 3, 2008, pp. 357-360.
[4] L. Verlet, “Computer Experiments on Classical Fluids,” Physical Review B, Vol. 159, No. 1, 1967, pp. 98-103. doi:10.1103/PhysRev.159.98
[5] M .S. Daw and M. I. Baskes, “Emebedded Atom Method Derivation and Ap-plication to Impurities, Surfaces, and Other Defects in Metals,” Physical Review B, Vol. 29, No. 12, 1984, pp. 6443-6453. doi:10.1103/PhysRevB.29.6443
[6] A. F. Voter and S. P. Chen, “Intermetallic Compounds: Prin-ciples and Practice,” Proceedings of Materials Research Society Symposium, Vol. 82, 1987, pp. 175-177.
[7] J. D. Honeycutt and H. C. Andresen, “Molecular Dynamics Study of Melting and Freezing of Small Lennard-Jones Clusters,” The Journal of Physical Chemistry, Vol. 91, No. 19, 1987, pp. 4950-4963. doi:10.1021/j100303a014

  
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