Study of Ni/Al Interface Diffusion by Molecular Dynamics Simulation ()
Abstract
Molecular dynamics simulation of Ni/Al interface diffusion is carried out by Embedded Atom Method (EAM) potential. The problem how the temperature affects Ni/Al interface diffusion is discussed. The initial dynamic behavior of Ni/Al interface diffusion at high temperature is shown. The study in this letter is helpful to understand the origin of diffusion phenomenon.
Share and Cite:
C. Zhang, H. Wang and Y. Qiu, "Study of Ni/Al Interface Diffusion by Molecular Dynamics Simulation,"
Engineering, Vol. 3 No. 3, 2011, pp. 227-232. doi:
10.4236/eng.2011.33026.
Conflicts of Interest
The authors declare no conflicts of interest.
References
|
[1]
|
J. Qi and Y. Song, “Experimental Studies on the Diffusion Reaction of Al /Ni /Fe Interface,” Metal Materials and Metallurgy Engineering, Vol. 35, No. 6, 2007, pp. 8-11.
|
|
[2]
|
Y. Song, S. Li and G. Du, “Forming Rule of Ti/Cu Interphase Diffusion Solution Zone,” Rare Metal Materials and Engineering, Vol. 38, No. 7, 2009, pp. 1188-1192.
|
|
[3]
|
M. Liu, J. Zhang and K.Xu, “Interface Diffusion and Resistivity of Ni/Al Nanomultilayers,” Acta Metallurgica Sinica, Vol. 44, No. 3, 2008, pp. 357-360.
|
|
[4]
|
L. Verlet, “Computer Experiments on Classical Fluids,” Physical Review B, Vol. 159, No. 1, 1967, pp. 98-103.
doi:10.1103/PhysRev.159.98
|
|
[5]
|
M .S. Daw and M. I. Baskes, “Emebedded Atom Method Derivation and Ap-plication to Impurities, Surfaces, and Other Defects in Metals,” Physical Review B, Vol. 29, No. 12, 1984, pp. 6443-6453. doi:10.1103/PhysRevB.29.6443
|
|
[6]
|
A. F. Voter and S. P. Chen, “Intermetallic Compounds: Prin-ciples and Practice,” Proceedings of Materials Research Society Symposium, Vol. 82, 1987, pp. 175-177.
|
|
[7]
|
J. D. Honeycutt and H. C. Andresen, “Molecular Dynamics Study of Melting and Freezing of Small Lennard-Jones Clusters,” The Journal of Physical Chemistry, Vol. 91, No. 19, 1987, pp. 4950-4963.
doi:10.1021/j100303a014
|