[1]
|
H. P. Degischer and B. Kriszt, “Handbook of Cellular Metals: Production, Processing and Applications,” WileyVCH Verlag GmbH & Co., 2002. http://dx.doi.org/10.1002/3527600558
|
[2]
|
S. Guarino, M. Barletta, S. Pezzola and S. Vesco, “Manufacturing of Steel Foams by Slip Reaction. Foam Sintering (SRFS),” Materials and Design, Vol. 40, 2012, pp. 268-275. http://dx.doi.org/10.1016/j.matdes.2012.03.022
|
[3]
|
M. Barletta, A. Gisario, S. Guarino and G. Rubino, “Production of Open Cell Aluminum Foams by Using the Dissolution and Sintering Process (DSP),” Journal of Manufacturing Science and Engineering, Vol. 131, No. 4, 2009, pp. 1087-1357. http://dx.doi.org/10.1115/1.3159044
|
[4]
|
G. Costanza, G. Gusmano, R. Montanari, M. E. Tata and N. Ucciardello, “Effect of Powder Mix Composition on Al Foam Morphology,” Journal of Materials: Design and Applications, Vol. 2, 2008, pp. 131-140.
|
[5]
|
M. W. Losey and J. J. Kelly, “Electro-Deposition,” Comprehensive Microsystems, Vol. 1, 2008, pp. 271-292. http://dx.doi.org/10.1016/B978-044452190-3.00010-0
|
[6]
|
A. Jung, H. Natter, R. Hempelmann, S. Diebels, M. R. Koblischka, U. Hartmann and E. Lach, “Nanocrystalline Alumina Dispersed in Nanocrystalline Nickel: Enhanced Mechanical Properties,” Journal of Materials Science, Vol. 44, No. 11, 2011, pp. 2725-2735. http://dx.doi.org/10.1007/s10853-009-3330-1
|
[7]
|
M. Schlesinger and M. Paunovic, “Modern Electroplating,” Wiley, New York, 2000.
|
[8]
|
A. Radisic, J. G. Long, P. M. Hoffmann and P. C. Searson, “Nucleation and Growth of Copper on TiN from Pyrophosphate Solution,” Journal of the Electrochemical Society, Vol. 148, No. 1, 2001, pp. C41-C46. http://dx.doi.org/10.1149/1.1344539
|