Synthesis and Characterization of Ultrafine Grained 304 Stainless Steel through Machining


The microstructures of 304 stainless steel chips created by plane strain machining at ambient temperature have been analyzed using scanning electron microscopy (SEM) and the crystallite size of the ultrafine chips were analyzed using X-Ray Diffraction Analysis. The strain imposed in the chips was varied by changing the tool rake angle. An attempt is made in the present investigation to correlate the plastic strain, strain rate with the grain size of the stainless steel.

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V. Senthilkumar and K. Lenin, "Synthesis and Characterization of Ultrafine Grained 304 Stainless Steel through Machining," Journal of Minerals and Materials Characterization and Engineering, Vol. 10 No. 5, 2011, pp. 455-461. doi: 10.4236/jmmce.2011.105034.

Conflicts of Interest

The authors declare no conflicts of interest.


[1] Swaminathan Srinivasan, Ravi Shankar M, Lee Seongyl, Hwang Jihong, King Alexander H, Kezar Renae F. Large strain deformation and ultra-fine grained materials by machining. J Mater Sci Eng 2005; 410–411:358–63.
[2] Brown Travis L, Swaminathan Srinivasan, Chandrasekar Srinivasan, Dale Compton W, King Alexander H, Trumble Kevin P. Low-cost manufacturing process for nanostructured metals and alloys. J Mater Res Soc 2002;17:2484–6.
[3] Zhilyaev A.P., Lee S., Nurislamova G.V., Valiev R.Z., Langdon T.G. Microhardness and microstructural evolution in pure nickel during high-pressure torsion. Scripta Mater 2001;44:2753-8.
[4] D.A. Hughes, N. Hansen. Microstructure and strength of nickel at large strains. Acta Mater 2000;48:2985-3004.
[5] Ravi Shankar M, Verma R, Rao BC, Chandrasekar S, Compton WD, King AH. Severe plastic deformation of difficult-to-deform materials at near-ambient temperatures. Metall Mater Trans 2007; 38A:1903.
[6] Manufacturing Processes, ASM Hand Book, Volume 16, 1993.

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