Modeling and Numerical Simulation of Material Science

Volume 2, Issue 2 (April 2012)

ISSN Print: 2164-5345   ISSN Online: 2164-5353

Google-based Impact Factor: 0.73  Citations  

Cellular Automata Simulation of Gap-Filler Dissolution during Transient Liquid Phase Bonding of Single Crystal Materials

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DOI: 10.4236/mnsms.2012.22002    5,989 Downloads   12,292 Views   Citations

ABSTRACT

A new numerical model is developed using a Cellular Automata (CA) method to study the liquid-phase dissolution behavior of gap-filler powder particles in interlayer powder mixture during transient liquid phase (TLP) bonding process. The model prediction of microstructural evolution in TLP joint between single crystal substrates show that formation of misoriented stray-grains results from incomplete liquation of the gap-filler powder particles. In contrast to what is generally assumed and reported, numerical calculations coupled with experimental verification show that under properly selected process parameters, complete melting of the gap-filler powder particles is possible. This is imperative to prevent the formation of misoriented stray-grains and maintain single crystallinity during TLP bonding of single crystal materials. The dependence of complete melting of the gap-filler particles on salient TLP bonding parameters are analyzed and discussed.

Cite this paper

A. Ghoneim and O. Akanbi Ojo, "Cellular Automata Simulation of Gap-Filler Dissolution during Transient Liquid Phase Bonding of Single Crystal Materials," Modeling and Numerical Simulation of Material Science, Vol. 2 No. 2, 2012, pp. 15-27. doi: 10.4236/mnsms.2012.22002.

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