Evaluation of Inherent Uncertainties of the Homogeneous Effective Thermal Conductivity Approach in Modeling of Printed Circuit Boards for Space Applications

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ISSN Print: 2162-6162
ISSN Online: 2162-6170
www.scirp.org/journal/jectc
E-mail: jectc@scirp.org

"Evaluation of Inherent Uncertainties of the Homogeneous Effective Thermal Conductivity Approach in Modeling of Printed Circuit Boards for Space Applications"
written by Rafael Lopes Costa, Valeri Vlassov,
published by Journal of Electronics Cooling and Thermal Control, Vol.3 No.1, 2013

has been cited by the following article(s):

[1]	Simulation of thermal conditions of a radio-electronic block of a cassette design
	2019

[2]	Modeling and thermal analysis of heat sink layers of multilayer board
	2019

[3]	Thermal properties of whole and tissue parts of pomegranate (Punica granatum) fruit
	2018

[4]	Analytical modeling of multi-layered Printed Circuit Board dedicated to electronic component thermal characterization
	Solid-State Electronics, 2015

[5]	Analytical modeling of multi-layered printed circuit board using multi-stacked via clusters as component heat spreader
	Thermal Science, 2014

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