"
Effect of Boron Addition on the Thermal Properties of Diamond-Particle-Dispersed Cu-Matrix Composites Fabricated by SPS"
written by Kiyoshi Mizuuchi, Kanryu Inoue, Yasuyuki Agari, Motohiro Tanaka, Takashi Takeuchi, Jun-ichi Tani, Masakazu Kawahara, Yukio Makino, Mikio Ito,
published by
Journal of Materials Science and Chemical Engineering,
Vol.4 No.9, 2016
has been cited by the following article(s):
|
[1]
|
Gradient interface formation in Cu–Cr/diamond (Ti) composites prepared by gas pressure infiltration
|
|
Vacuum,
2022 |
|
|
|
|
[2]
|
Preparation and research process of high thermal conductivity metal matrix composites
|
|
rui, LIU Chao, XIE Yan-chong… - 粉末冶金 …,
2022 |
|
|
|
|
[3]
|
高导热金属基复合材料的制备与研究进展
|
|
粉末冶金技术,
2022 |
|
|
|
|
[4]
|
通電焼結を応用した金属基複合材料の高機能化
|
|
粉体および粉末冶金,
2022 |
|
|
|
|
[5]
|
光触媒を用いたダイヤモンドのアミノ基修飾と銅基質に対する高分散複合化技術
|
|
表面技術,
2021 |
|
|
|
|
[6]
|
Development of a Frequency-domain Thermoreflectance Instrument for Thermal Characterization of Diamond-based Composites
|
|
2021 |
|
|
|
|
[7]
|
ABOUT INCORRECT AND UNREPRESENTATIVE CITATION IN THE REVIEW “HIGH THERMAL CONDUCTIVE COPPER/DIAMOND COMPOSITES: STATE OF THE …
|
|
Известия Санкт-Петербургского …,
2021 |
|
|
|
|
[8]
|
Preparation of amino group functionalized diamond using photocatalyst and thermal conductivity of diamond/copper composite by electroplating
|
|
2021 |
|
|
|
|
[9]
|
Microstructural evolution of sandwiched Cr interlayer in Cu/Cr/diamond subjected to heat treatment
|
|
Thin Solid Films,
2021 |
|
|
|
|
[10]
|
High thermal conductive copper/diamond composites: state of the art
|
|
2020 |
|
|
|
|
[11]
|
Mechanical Properties of Cu-B/Diamond Composites Prepared by Gas Pressure Infiltration
|
|
2020 |
|
|
|
|
[12]
|
Tunable coefficient of thermal expansion of Cu-B/diamond composites prepared by gas pressure infiltration
|
|
2019 |
|
|
|
|
[13]
|
Comparative study between tribological performance of carbide reinforced functionally graded copper composite and its alloy under the influence of process …
|
|
2019 |
|
|
|
|
[14]
|
Tailoring interface structure and enhancing thermal conductivity of Cu/diamond composites by alloying boron to the Cu matrix
|
|
2019 |
|
|
|
|
[15]
|
Thermal conductivity of Cu-Ti/diamond composites via spark plasma sintering
|
|
2019 |
|
|
|
|
[16]
|
金刚石/Cu 复合界面导热改性及其纳米化研究进展
|
|
2018 |
|
|
|
|
[17]
|
Theoretical modelling for interface design and thermal conductivity prediction in diamond/Cu composites
|
|
Diamond and Related Materials,
2018 |
|
|
|
|
[18]
|
High thermal conductivity of Cu-B/diamond composites prepared by gas pressure infiltration
|
|
Journal of Alloys and Compounds,
2018 |
|
|
|
|
[19]
|
Structure and Thermal Properties of Layered Ti-clad Diamond/Cu Composites Prepared by SPS and HP
|
|
Rare Metal Materials and Engineering,
2018 |
|
|
|
|
[1]
|
Enhancing Metal-Matrix Composites Performance via Spark Plasma Sintering (SPS) Process
Journal of the Japan Society of Powder and Powder Metallurgy,
2022
DOI:10.2497/jjspm.69.441
|
|
|
|
|
[2]
|
High thermal conductive copper/diamond composites: state of the art
Journal of Materials Science,
2021
DOI:10.1007/s10853-020-05443-3
|
|
|
|
|
[3]
|
Comparative study between tribological performance of carbide reinforced functionally graded copper composite and its alloy under the influence of process parameters
Materials Research Express,
2019
DOI:10.1088/2053-1591/ab1a98
|
|
|
|
|
[4]
|
Structure and Thermal Properties of Layered Ti-clad Diamond/Cu Composites Prepared by SPS and HP
Rare Metal Materials and Engineering,
2018
DOI:10.1016/S1875-5372(18)30173-5
|
|
|
|