EBSD Analysis of the Submicron Width Fibber Shaped Grain Copper Fabricated by Drawing

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ISSN Print: 2153-117X
ISSN Online: 2153-1188
www.scirp.org/journal/msa
E-mail: msa@scirp.org

"EBSD Analysis of the Submicron Width Fibber Shaped Grain Copper Fabricated by Drawing"
written by Masafumi Matsushita, Tomoya Kuji, Hiromitsu Kuroda, Seigi Aoyama, Hiroaki Ohfuji,
published by Materials Sciences and Applications, Vol.2 No.7, 2011

has been cited by the following article(s):

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[1]	Structure and Mechanical Properties of Electrical Copper Wire Processed by Coarse and Medium Drawing Materials Science Forum, 2019 DOI:10.4028/www.scientific.net/MSF.946.845

[2]	Relationship between Deformation and Recrystallization Texture in Copper Wire Materials Science Forum, 2017 DOI:10.4028/www.scientific.net/MSF.907.173

[3]	Calculation of the strain state under multipass wire drawing 2016 DOI:10.1063/1.4967089

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