Journal of Electronics Cooling and Thermal Control

Journal of Electronics Cooling and Thermal Control

ISSN Print: 2162-6162
ISSN Online: 2162-6170
www.scirp.org/journal/jectc
E-mail: jectc@scirp.org
"Investigation of Thermal Characterization of a Thermally Enhanced FC-PBGA Assembly"
written by C. F. Lin, G. H. Wu, S. H. Ju,
published by Journal of Electronics Cooling and Thermal Control, Vol.3 No.3, 2013
has been cited by the following article(s):
  • Google Scholar
  • CrossRef
[1] Thermal decomposition of solder flux activators under simulated wave soldering conditions
Soldering & Surface Mount Technology, 2017
[2] Study of enhanced plastic ball grid array (EPBGA) package with heat spreader of copper plane
Electronic Packaging Technology (ICEPT), 2015 16th International Conference on, 2015
Free SCIRP Newsletters
Copyright © 2006-2024 Scientific Research Publishing Inc. All Rights Reserved.
Top