Stress Sensing by an Optical Fiber Sensor: Method and Process for the Characterization of the Sensor Response Depending on Several Designs

Journals Menu

Follow SCIRP

ISSN Print: 2160-8881
ISSN Online: 2160-889X
www.scirp.org/journal/opj
E-mail: opj@scirp.org

"Stress Sensing by an Optical Fiber Sensor: Method and Process for the Characterization of the Sensor Response Depending on Several Designs"
written by Mustapha Remouche, Francis Georges, Patrick Meyrueis,
published by Optics and Photonics Journal, Vol.3 No.2, 2013

has been cited by the following article(s):

[1]	Review of Wearable Sensor-Based Health Monitoring Glove Devices for Rheumatoid Arthritis
	2021

[2]	A Step-Index Multimode Fiber-Optic Microbend Displacement Sensor Wavelength Dependent Loss
	Strategic Applications of Measurement Technologies and Instrumentation, 2019

[3]	ASE Noise Characterization of an All-Fiber Sagnac Interferometer via LAN for Remote Sensing
	2018

[4]	Combination of Researching and Teaching in “Optical Fiber Sensing Technology” Course
	2017

[5]	Study of Wavelength-Dependent Bend Loss in Step-Index Multimode Fiber-Optic Microbend Displacement Sensor
	International Journal of Measurement Technologies and Instrumentation Engineering (IJMTIE), 2017

[6]	Optimization and thermal ASE noise characterization of an all-fibre Sagnac interferometer via LAN for sensing applications
	2016

[1]	Review of Wearable Sensor-Based Health Monitoring Glove Devices for Rheumatoid Arthritis Sensors, 2021 DOI:10.3390/s21051576

[2]	Strategic Applications of Measurement Technologies and Instrumentation Advances in Chemical and Materials Engineering, 2019 DOI:10.4018/978-1-5225-5406-6.ch003

[3]	Study of Wavelength-Dependent Bend Loss in Step-Index Multimode Fiber-Optic Microbend Displacement Sensor International Journal of Measurement Technologies and Instrumentation Engineering, 2017 DOI:10.4018/IJMTIE.2017010102

[4]	Optimization and thermal ASE noise characterization of an all-fibre Sagnac interferometer via LAN for sensing applications Infrared Sensors, Devices, and Applications VI, 2016 DOI:10.1117/12.2237898

Follow SCIRP