Materials Sciences and Applications

Materials Sciences and Applications

ISSN Print: 2153-117X
ISSN Online: 2153-1188
www.scirp.org/journal/msa
E-mail: msa@scirp.org
"Effect of Antimony Additions on Corrosion and Mechanical Properties of Sn-Bi Eutectic Lead-Free Solder Alloy"
written by Alberto Torres, Luis Hernández, Octavio Domínguez,
published by Materials Sciences and Applications, Vol.3 No.6, 2012
has been cited by the following article(s):
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[12] A Study on the Electrochemical Corrosion Property of Sn-xSb Solder Alloy
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[14] Preparation, Microstructure and Properties of Environmentally Friendly Sn-58Bi Eutectic Solder Ribbon for Electronic Package.
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[15] Effects of Sb and Zn Addition on Mechanical Properties and Corrosion Resistance of Sn–Ag–Cu Solders
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[16] Effects of Solidification Thermal Parameters on Microstructure and Mechanical Properties of Sn-Bi Solder Alloys
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[17] Preparation, Microstructure and Properties of Environmentally Friendly Sn-58Bi Eutectic Solder Ribbon for Electronic Package
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[18] Corrosion reliability of lead-free solder systems used in electronics
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[19] Effects of Sb and Zn Addition on Mechanical Properties and Corrosion Resistance of Sn-Ag-Cu Solders.
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[20] Ni 添加對 Sn-1.5 Ag-0.7 Cu 低銀無鉛銲料顯微組織與機械性質影響之研究
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[21] Characterization of Indium addition on Sn-Bi-Sb Lead free Solder alloy
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[22] A Comparative Study of the Sn-Ag, Sn-Zn, Sn-Cu, Sn-Bi Lead Free Solder Alloys with the Commercially Available Sn-Pb Solder Alloy
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[25] Microstructural development and mechanical properties of a near-eutectic directionally solidified Sn-Bi solder alloy
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[26] Microstructural development and mechanical properties of a near-eutectic directionally solidified Sn–Bi solder alloy
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[27] Characterization of Melt-Quenched SnSbBiAl Alloys Used in Fusible Elements of Low Voltage Fuses
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