has been cited by the following article(s):
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[1]
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Progress in Optimization of Physical Vapor Deposition of Thin Films
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2021 |
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[2]
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Process chain for the fabrication of hardenable aluminium-zirconium micro-components by deep drawing
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5th International Conference on New Forming Technology (ICNFT 2018),
2018 |
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[3]
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The Effect of Interfacial Ge and RF-Bias on the Microstructure and Stress Evolution upon Annealing of Ag/AlN Multilayers
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2018 |
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[4]
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الارتباط بين عرض واجهة فلم–ركائز وقوة التصاق أفلام النحاس الرقيقة المغلفة لركائز الصلب الكربوني المصقولة بالأيونات عن طريق التغيير في الجهد كهربائي المتحيز …
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2017 |
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[5]
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Correlation between the Interface Width and the Adhesion Strength of Copper Films Deposited on Ion-Etched Carbon Steel Substrates by Varying the Bias Voltage
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2017 |
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[6]
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The rotating substrate holder of sputtering deposition for effective growth of thin copper films
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Science and Technology (TICST), 2015 International Conference on,
2015 |
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[7]
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Thickness Measurement of Aluminum Thin Film using Dispersion Characteristic of Surface Acoustic Wave
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IK Park, TS Park - s2is.org,
2014 |
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[8]
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Influence of the Process Parameters on the Properties of Sput-tered Aluminum-Zirconium Sheets
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Kovac, J., K?hler, B., Ramdani, Y., Henry, J., Stock, H. R., von Bargen, R., & Mehner, A. ,
2014 |
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[9]
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Correlation between the Interface Width and the Adhesion Strength of Copper Films Deposited on Ion-Etched Carbon Steel Substrates by Varying the Bias …
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A Ouis, K Touileb, R Djoudjou
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[1]
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Data-Driven Optimization of Manufacturing Processes
Advances in Civil and Industrial Engineering,
2021
DOI:10.4018/978-1-7998-7206-1.ch015
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[2]
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Process chain for the fabrication of hardenable aluminium-zirconium micro-components by deep drawing
MATEC Web of Conferences,
2018
DOI:10.1051/matecconf/201819015013
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[3]
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The Effect of Interfacial Ge and RF-Bias on the Microstructure and Stress Evolution upon Annealing of Ag/AlN Multilayers
Applied Sciences,
2018
DOI:10.3390/app8122403
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[4]
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The rotating substrate holder of sputtering deposition for effective growth of thin copper films
2015 International Conference on Science and Technology (TICST),
2015
DOI:10.1109/TICST.2015.7369414
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[5]
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Thickness Measurement of Aluminum Thin Film using Dispersion Characteristic of Surface Acoustic Wave
International Journal on Smart Sensing and Intelligent Systems,
2014
DOI:10.21307/ijssis-2019-049
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[6]
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Thickness Measurement of Aluminum Thin Film using Dispersion Characteristic of Surface Acoustic Wave
International Journal on Smart Sensing and Intelligent Systems,
2014
DOI:10.21307/ijssis-2019-049
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[7]
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Thickness Measurement of Aluminum Thin Film using Dispersion Characteristic of Surface Acoustic Wave
International Journal on Smart Sensing and Intelligent Systems,
2014
DOI:10.21307/ijssis-2019-049
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