has been cited by the following article(s):
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[1]
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Laser Thermal Wave Diagnostics of the Thermal Resistance of Soldered and Bonded Joints in Semiconductor Structures
Sensors,
2023
DOI:10.3390/s23073590
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[2]
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Thermal Characterization of Magnetic Components in Still Air
IEEE Transactions on Power Electronics,
2023
DOI:10.1109/TPEL.2023.3253076
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[3]
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Experimental and numerical study heat transfer performance for printed circuit board
4TH INTERNATIONAL SCIENTIFIC CONFERENCE OF ENGINEERING SCIENCES AND ADVANCES TECHNOLOGIES,
2023
DOI:10.1063/5.0163913
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[4]
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Applied Modeling Framework in Integrated Circuit Design and Reliability
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
2022
DOI:10.1109/ECTC51906.2022.00043
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