"Numerical Analysis of Printed Circuit Board with Thermal Vias: Heat Transfer Characteristics under Nonisothermal Boundary Conditions"
written by Yasushi Koito, Yoshihiro Kubo, Toshio Tomimura,
published by Journal of Electronics Cooling and Thermal Control, Vol.3 No.4, 2013
has been cited by the following article(s):
  • Google Scholar
  • CrossRef