Mechanical Properties of Micro- and Nanostructured Copper Films

ISSN Print: 2327-6045
ISSN Online: 2327-6053

Website: https://www.scirp.org/journal/msce
E-mail: msce@scirp.org

"Mechanical Properties of Micro- and Nanostructured Copper Films"
written by N. Kosarev, M. Khazin, R. Apakashev, N. Valiev,
published by Journal of Materials Science and Chemical Engineering, Vol.1 No.5, 2013

has been cited by the following article(s):

[1]	Effect of Temperature on the Structure and Properties of Fine-Grain Copper Foil
	2020

[2]	Влияние температуры на структуру и свойства мелкозернистой медной фольги
	2019

[3]	ВЛИЯНИЕ ТЕМПЕРАТУРЫ НА МЕХАНИЧЕСКИЕ СВОЙСТВА МЕЛКОЗЕРНИСТОЙ МЕДНОЙ ФОЛЬГИ
	2019

[4]	МИКРО-И НАНОСТРУКТУРИРОВАННЫЕ ПЛЕНКИ МЕДИ В МАШИНОСТРОЕНИИ
	2019

[5]	НАНОСТРУКТУРИРОВАННЫЕ МЕТАЛЛИЧЕСКИЕ МАТЕРИАЛЫ ДЛЯ ОБРАБОТКИ КАМНЯ
	2019

[6]	Combinatorial investigation of hardening mechanisms in compositional gradient and multilayer thin films
	2018

[7]	Microstructure and mechanical properties of metastable solid solution copper‑tungsten films
	Thin Solid Films, 2017

[8]	Microstructure and property of Cu–2.7 Ti–0.15 Mg–0.1 Ce–0.1 Zr alloy treated with a combined aging process
	Materials Science and Engineering: A, 2016