Author(s)

Zakaria Boumerzoug, Salim Gareh, Abdellatif Beribeche

Laboratory of Metallicans Semiconductor Materials, University of Biskra, Biskra, Algeria.

The effect of prior-heat treatments at 500℃, 600℃ and 700℃ on the creep behavior of an industrial drawn copper has been studied under constant stresses (98, 108 and 118 MPa) and temperatures (290℃ and 340℃). The results revealed that the creep behavior and the creep life of the material depend strongly on these prior-heat treatments. The apparent activation energy Q_c for different creep tests of a drawn copper wire was calculated. The fracture mechanism of the material is characterized using optical microscopy.

Copper; Creep; Drawn Wire; Heat Treatment

Z. Boumerzoug, S. Gareh and A. Beribeche, "Effect of Prior-Heat Treatments on the Creep Behavior of an Industrial Drawn Copper," World Journal of Condensed Matter Physics, Vol. 2 No. 4, 2012, pp. 241-245. doi: 10.4236/wjcmp.2012.24041.