World Journal of Mechanics

ISSN Print: 2160-049X    ISSN Online: 2160-0503

Call For Papers


    Special Issue on Solid Mechanics


    Solid mechanics is the branch of physics and mathematics that concerns the behavior of solid matter under external actions. It has been advanced by participating in major inventions throughout history, such as buildings, ships, automobiles, railways, petroleum refineries, engines, airplanes, nuclear reactors, composite materials, computers, and medical implants. In such connections, the discipline is also known as engineering mechanics, often practiced within civil engineering, mechanical engineering, materials science and engineering, aerospace engineering, chemical engineering, electrical engineering, nuclear engineering, structural engineering, and bioengineering. The goal of this special issue is to provide a platform for scientists and academicians all over the world to promote, share, and discuss various new issues and developments in this area of solid mechanics.


    In this special issue, we invite front-line researchers and authors to submit original research and review articles that explore solid mechanics. In this special issue, potential topics include, but are not limited to:


    • Plasticity and viscoelasticity theory
    • Vibrations of solids and structures
    • Fracture and damage mechanics
    • Stability of structures
    • Dynamical systems and chaos
    • Solid mechanics, materials & structures
    • Mechanical properties 


    Authors should read over the journal’s For Authors carefully before submission. Prospective authors should submit an electronic copy of their complete manuscript through the journal’s Paper Submission System.


    Please kindly specify the Special Issue” under your manuscript title. The research field “Special Issue Solid Mechanics” should be selected during your submission.


    Special Issue timetable:


    Submission Deadline

          November 15th, 2018

    Publication Date

              January 2019


    Guest Editor:


    For further questions or inquiries

    Please contact Editorial Assistant at