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Biography

Dr. Winco K.C. Yung
Department of Industrial and Systems Engineering
The Hong Kong Polytechnic University, China
Associate Professor

Email: mfkcyung@inet.polyu.edu.hk

Qualifications

1998 Ph.D., Brunel University of West London, U.K
1990 M.Sc., University of Hong Kong, Hong Kong, China
1983 B.SC. Sydney University, Australia

Publications

  1. ZHANG, B. and YUNG, K.C., Frequency-tripled Nd:YAG laser ablation in laser structuring process, Optics and Lasers in Engineering, Vol. 44, Issue 8, pp. 815-825, August 2006.
  2. CHAN, C.Y. & YUNG, K.C., Investigation of thermal characteristics of embedded resistors, Electronic Components and Materials, Vol. 24, No. 12, pp.61-63, December 2005.
  3. YUNG, K.C., WU, J. & YUE, T.M., Size Effect of AIN on the Performance of Printed Circuit Boards (PCBs) Materials, Journal of Composite Materials. Vol. 40, No. 7, pp. 567-581, April 2006.
  4. ZHANG, B. and YUNG, K.C. Quality and reliability of fine lines fabricated by laser structuring technique, Industrial Engineering Research, Vol. 3, No. 1, pp.10-19., May 2006.
  5. ZHANG, B. and YUNG, K.C., Feasibility of the 248 nm Excimer laser in laser structuring of fine circuit lines on Printed Circuit Board. The International Journal of Advanced Manufacturing Technology, Vol. 33 (11-12), pp. 1149-1158, December 2006
  6. YUNG, K.C., WANG, J., Modeling Young's Modulus of Polymer Layered Silicate Nanocomposites Using a Modified Halpin-Tsai Micromechanical Model. Journal of Reinforced Plastics & Composites. Vol. 25, No. 8, 847-861, May 2006.
  7. FANG X.Y & YUNG, K.C., Copper direct drilling with TEA CO2 laser in manufacture of high-density interconnection Printed Circuit Board, IEEE Transactions on Electronics Packaging Manufacturing. Vol. 29, No.3, pp. 145-149, July 2006.
  8. YUNG, K.C., WANG, J., S.Q. Huang, C.P.Lee and YUE, T.M., Modeling the etching rate and uniformity of plasma-aided manufacturing using statistical experimental design. Materials and Manufacturing Processes. Vol. 21, Issue 8, pp 899-906, Nov 2006.
  9. YUNG, K.C., WANG, J. & YUE, T.M., Fabrication of Epoxy-Montmorillonite Hybrid Composites used for Printed Circuit Board via in-situ Polymerization, Advanced Composite Materials, Vol. 15, No. 4, pp. 371-384, October 2006.
  10. YUNG, K.C., WANG J and YUE, T.M., Surface characterisation of pre-treated copper foilused for PCB lamination. Journal of Adhesion Science Technology, Vol. 21, No.5-6, pp.363-377, April 2007.
  11. Yung K.C., Research of Processing Technology for Rigid-flex Printed Circuits, The Hong Kong Polytechnic University (ISBN 978-962-86893-3-0), Total number of pages: 46, Feb 2007.
  12. Yung K.C., Thermal Conductive Dielectric Materials used for Metal Core Printed Circuit Boards, The Hong Kong Polytechnic University (ISBN 978-962-86893-4-7), Total number of pages: 47, December 2007.
  13. Yung, K.C. et. al, A Case Study of an EcoDesign and Manufacturing Programme for Electronic Products with reference to the Energy Using Product (EuP) Directive 2005/32/EC. The Hong Kong Polytechnic University, (ISBN 978-962-86893-4-7), Total number of pages: 292, July 2008
  14. Yung K.C., Development of Liquid Crystal Polymer (LCP) PCB Manufacturing Technology, The Hong Kong Polytechnic University (ISBN 978-962-86893-5-4). Total number of pages: 86, November 2008.
  15. Yung K.C., Macroscopic and Microscopic Study of Different Reliability Tests of High Performance Printed Circuit, The Hong Kong Polytechnic University (ISBN 978-962-86893-6-1), Total number of pages: 24, September 2009.
  16. Yung K.C., Development of Printed Organic Electronics manufacturing technology for high volume production, The Hong Kong Polytechnic University (ISBN 978-962-86893-7-8), Total number of pages: 68, December 2009.
  17. Yung, K.C. Development of Gas-assisted Mechanical Drilling Technoogy in PCB fabrication, The Hong Kong Polytechnic University (ISBN 978-962-86893-8-5). Total number of pages: 33, June 2010.
  18. Yung K.C., Development of laser selective activation and metallization technology for the manufacturing of ceramic interconnect substrate (CIS), The Hong Kong Polytechnic University (ISBN 978-962-86893-9-2). Total number of pages: 93, January 2011.