Thermal and Electrical Properties of Sn-Zn-Bi Ternary Soldering Alloys

M. A. Wadud¹, M. A. Gafur^2*, M. R. Qadir², M. O. Rahman¹

¹Department of Physics, Jahangirnagar University, Savar, Bangladesh.
²PP&PDC, BCSIR, Dhaka, Bangladesh.

DOI: 10.4236/msa.2015.611100                

Abstract

Sn-Zn based solder is a possible replacement of Pb solder because of its better mechanical properties. The alloys need to be studied and explored to get a usable solder alloy having better properties. In this work, eutectic Sn-9Zn and three Tin-Zinc-Bismuth ternary alloys were prepared and investigated their thermal and electrical properties. Thermo-mechanical Analysis and Differential Thermal Analysis were used to investigate thermal properties. Microstructural study is carried out with Scanning Electron Microscope. The alloys have single melting point. The co-efficient of thermal expansion and co-efficient of thermal contraction varies with alloy composition and temperature range. Electrical conductivity changes with Bi addition.

Keywords

Lead Free Solder Alloy, Eutectic Alloy, DTA, TMA, Conductivity

Conflicts of Interest

The authors declare no conflicts of interest.

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