Using Microgripper in Development of Automatic Adhesive Glue Transferring and Binding Microassembly System

R. J. CHANG, C. C. CHEN

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DOI: 10.4236/eng.2010.21001                

Abstract

A system using microgripper for gluing and adhesive bonding in automatic microassembly was designed, implemented, and tested. The development of system is guided by axiomatic design principle. With a compliant PU microgripper, regional-edge-statistics (RES) algorithm, and PD controller, a visual-servoing system was implemented for gripping micro object, gluing adhesive, and operating adhesive bonding. The RES algorithm estimated and tracked a gripper’s centroid to implement a visual-servoing control in the microassembly operation. The main specifications of the system are: gripping range of 60~80μm, working space of 7mm×5.74mm×15mm, system bandwidth of 15Hz. In the performance test, a copper rod with diameter 60μm was automatically gripped and transported for transferring glue and bonding. The 60μm copper rod was dipped into a glue container and moved, pressed and bonding to a copper rod of 380μm. The amount of binding glue was estimated about 5.7nl.

Keywords

Micro Gripper, Adhesive Bonding, Microassembly, Visual Servo

Conflicts of Interest

The authors declare no conflicts of interest.

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