Mechanical Properties of Micro- and Nanostructured Copper Films


Mechanical properties of electrodeposited and electroless copper with nano- and crystalline structure are considered. Grain diameters in films ranged from 0.06 to 8 μm. A model is described which takes into account the grain boundary hardening and density of dislocation.

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Kosarev, N. , Khazin, M. , Apakashev, R. and Valiev, N. (2013) Mechanical Properties of Micro- and Nanostructured Copper Films. Journal of Materials Science and Chemical Engineering, 1, 7-10. doi: 10.4236/msce.2013.15002.

Conflicts of Interest

The authors declare no conflicts of interest.


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