Prof.Yee-Wen Yen

Department of Materials Science and Engineering,

National Taiwan University of Science and Technology, Chinese Taipei

Assiociate Professor

E-mail: ywyen@mail.ntust.edu.tw

Qualifications

1997-2002  Ph.D., Department of Chemical Engineering, National Tsing Hua University, Hinchu, Chinese Taipei

1995-1997  M.Sc., Department of Chemical Engineering, National Tsing Hua University, Hinchu, Chinese Taipei

1991-1995  B.Sc., Department of Chemical Engineering, National Tsing Hua University, Hinchu, Chinese Taipei

Publications(Selected)

1. Substrate Shape Effect on the Sn Whisker Growth in the Electroplating Matte Sn System, Yee-Wen Yen*, Chao-Kang Li, Meng-Yu Tsou, Japanese Journal of Applied Physics, Vol. 50, pp. 01BJ07-1-4 (2011). (SCI:1.024)
2. Interfacial reactions between high-Pb solders and Ag Source, Chi-Pu Lin, Chih-Ming, Chen, Yee-Wen, Yen, Hsin-Jay, Wu, Sinn-Wen Chen, Journal of Alloys and Compounds, Vol. 509, pp. 3509-3514 (2011). (SCI: 2.138)
3. ACF Particle Distribution on COG Process, Yee-Wen Yen* and Chun-Yu Lee, Microelectronics Reliability, vol. 51, pp. 676-684 ( 2011) (SCI:1.101)
4. Interfacial reactions and Mechanical Properties between Sn-Ag-Cu and Sn-Ag-Cu-Ni-Ge Lead-free Solders with Au/Ni/Cu Substrate, Yee-wen Yen*, Yu-Cheng Chiang, Chien-Chung Jao, Da-Wei Liaw, Shao-Cheng Lo, Chiapyng Lee, Journal of Alloys and Compounds, Vol. 509, pp. 4595-4602 (2011). (SCI: 2.138)
5. Interfacial reactions in the Sn-xBi/Au couples, Yee-wen Yen*, Wei-Kai Liou, Chao-Ming Chen, Cheng-Kuan Lin, Meng-Kuang Huang, Materials Chemistry and Physics, Vol. 128, pp. 233-237 (2011). (SCI 2.356)
6. Investigation of Interfacial Reactions and Sn Whisker Formation in the Matte Sn layer with NiP/Ni/Cu and Ni/Cu Multi-layer Systems, Wei-kai Liou , Yee-Wen Yen*, Chien-Chung Jao, Meng-Yu Tsou, IEEE Transactions on Component Packaging Manufacturing (IEEE Transactions on Electronics Packaging Manufacturing), Vol. 1, June, pp. 951-956 (2011) (SCI: 0.892)
7. Interfacial Reactions in the Sn/Fe-xNi couples, Yee-Wen Yen*, Hsien-Ming Hsiao, Shih-Wei Lin, Pin-Ju Huang, Chiapyng Lee, Journal of Electronic Materials Vol. 41, pp. 144-152 (2012) (SCI: 1.421)
8. Interfacial Reactions on Pb-Free Solders with Au/Pd/Ni/Cu Multilayer Substrates, Yee-wen Yen*, Po-hao Tsai, Yang-kai Fang, Shao-cheng Lo, Yu-Ping Hsieh, Chiapyng Lee, Journal of Alloys and Compounds, Vol. 503, pp. 25-30 (2010). (SCI: 2.138)
9. Interfacial reactions of Sn-58Bi and Sn-9Zn lead-free solders with the multilayer Au/Ni/SUS 304 substrate, Yee-wen Yen*, Da-wei Liaw, Kuen-da Chen, Hao Chen, Journal of Electronic Materials, Vol. 29, pp.2412-2417 (2010)(SCI: 1.421)
10. Abnormal spalling phenomena in the Sn-0.7Cu/Au/Ni/SUS304 interfacial reactions, Shih-kang Lin, Kuen-da Chen, Hao Chen, Wei-kai Liou, and Yee-wen Yen*, Journal of Materials Research, Vol. 25, pp. 2278-2286 (2010). (SCI: 1.421)
11. Interfacial Reactions between Pb-Free Solders and In/Ni/Cu Multilayer Substrates, Yee-Wen Yen*, Wei-Kai Liou, Hong-Yao Wei, Chiapyng Lee, Journal of Electronic Materials, vol. 38, pp.93-99 (2009). (SCI: 1.421)
12. Phase Equilibria of the Au-Sn-Zn Ternary System and Interfacial Reactions in Sn-Zn/Au Couples, Wei-kai Liou and Yee-Wen Yen*, Intermetallics Vol. 17, pp.72-78 (2009). (SCI: 2.335)
13. Interfacial reactions between Lead-free solders and the multilayer Au/Ni/SUS304SS substrate, Yee-Wen Yen*, Chun-Yu Le, Meng-Han Kuo, Kuo-Sing Chao, Kuen-da Chen, International Journal of Materials Research, Vol. 100, pp. 672-676 (2009). (SCI: 0.860)
14. Interfacial reactions between Sn-9Zn + Cu lead-free solders and the Au substrate, Wei-kai Liou, Yee-Wen Yen*, Kuen-Da Chen, Journal of Alloys and Compounds, Vol. 479, pp. 225-229 ( 2009). (SCI: 2.138)
15. Cross-interaction between Au/Sn and Cu/Sn interfacial reaction, Yee-Wen Yen, H. W. Tseng, K. Zeng , S.J. Wang, C.Y Liu, Journal of Electronic Materials, Vol. 38, pp. 2257-2263 (2009) (SCI: 1.421)
16. Interfacial reactions between Ni/430 stainless steel as the interconnect material and Ag–Cu alloy fillers in a solid oxide fuel cell system, Yee-Wen Yen*, Chun-Yu Lee, Don-Ping Huang and Jian-Wei Su, Journal of Alloys and Compounds, vol. 466, pp. 383-386 (2008). (SCI: 2.138)
17. Synthesize carbon nanotubes by a novel method using chemical vapor deposition-fluidized bed reactor from solid-stated polymers, Yee-Wen Yen*, Ming-De Huang and Fu-Jen Lin, Diamond and Related Materials, vol. 17, pp.567-570 (2008). (SCI: 1.825)
18. Investigation of Dissolution Behavior of Metallic Substrates and Intermetallic Compounds in Molten Lead-free Solders, Yee-Wen Yen*, Weng-Ting Chou, Yu Tseng, Chiapyng Lee , Chung-Lei Hsu, Journal of Electronic Materials, vol. 37, pp.73-83 (2008) (SCI: 1.421)
19. Phase Equilibria of the Sn-Sb-Ag Ternary System and Interfacial Reactions at the Sn-Sb/Ag Joints at 400°C and 150°C, Chung-Yung Lin, Chiapyng Lee, Xingjun Liu and Yee-Wen Yen, Intermetallics, vol. 16, pp.230-238 (2008). (SCI: 2.335)
20. The 260°C phase equilibria of the Sn-Sb-Ag ternary system and interfacial reactions at the Sn-Sb/Ag joints, Chiapyng Lee, Chung-Yung Lin, and Yee-Wen Yen, Journal of Alloys and Compounds, vol. 458, pp. 436-445 (2008) (SCI: 2.138)
21. Effect upon Minor Addition of Pb on Interfacial Reactions and Mechanical Properties at Sn-3.0Ag-0.5Cu/Cu and Sn-58Bi/Cu Joints, Yee-Wen Yen*, Weng-Ting Chou, Hong-Chih Chen, Wei-kai Liou, Chiapyng Lee, International Journal of Materials Research, Vol. 99, pp.1251-1256 (2008). (SCI: 0.860)
22. Investigation of the Phase Equilibria of Sn-Cu-Au Ternary and Ag-Sn-Cu-Au Quaternary Systems and Interfacial Reactions in Sn-Cu/Au couples, Yee-Wen Yen*, Chien-Chung Jao, Hsien-Ming Hslao, Chung-Yung Lin and Chiapyng Lee, Journal of Electronic Materials, Vol. 36, pp. 147-158 (2007). (SCI: 1.421)
23. Investigation of thermal stability of Mo Thin-Film as the Buffer Layer and Cu Metallization for Application in TFT-LCDs, Yee-Wen Yen*, Yu-Lin Kuo, Jian-Yu Chen, Hung-Yao Wei, Chiapyng Lee, Chung-Yu Lee and Hsin-Hung Lee, Thin Solid Films, Vol. 515, pp. 7209-7216 (2007). (SCI: 1.935)
24. Study of Interfacial Reactions between Sn-Ag-Cu Alloys and Au Substrate, Chien-Chung Jao, Yee-Wen Yen*, Shu-Hao Zhang, Chung-Yung Lin, Chiapyng Leee, International Journal of Materials Research, Vol. 98, pp. 496-500 (2007). (SCI: 0.860)
25. Electroenhanced Metallorganic Chemical Vapor Deposition of Copper Films, Yu-Lin Kuo, Chiapyng Lee, Gene Chen, Kou-Liang Liu, Yee-Wen Yen, Electrochemical and Solid-State Letters, Vol. 10, pp. 51-54 (2007). (SCI: 1.981)
26. The 260°C Phase Equilibria of the Sn-Sb-Cu Ternary System and Interfacial Reactions at the Sn-Sb/Cu Joints Chiapyng Lee, Chung-Yung Lin, and Yee-Wen Yen, Intermetallics, vol. 15, pp.1027-1037 (2007). (SCI: 2.335)