Biography

Dr. Hong Jin Kim

Globalfoundries, USA

Principal Engineer


Email: khj9355@hotmail.com


Qualifications

2007 Ph.D., The Ohio State University, USA, Materials Science and Engineering

2001 M.Sc., Korea Advanced Institute of Science and Technology, Korea (South), Materials Science and Engineering

1999 B.Sc., Korea University, Korea (South), Metallurgical Engineering


Publications(Selected)

  1. Sol Han, H-J Kim, M Hong, B Kwon, K Lee, Y Ko, “Effect of pad surface roughness on material removal rate in chemical mechanical polishing using ultrafine colloidal ceria slurry”, Electronic Materials Letters 9(2), pp.155-159, 2013.
  2. H-J Kim, Y-J Jang, J-K Choi, B Kwon, K Lee, Y Ko, “Tribological approaches to the removal rate during chemical mechanical polishing”, Metals and Materials International 19(2), pp.335-339, 2013.
  3. H-J Kim, J-K Choi, M Hong, K Lee, Y Ko, “Contact behavior and chemical mechanical polishing (CMP) performance of hole-type polishing pad”, ECS Journal of Solid State Science and Technology 1(4) P204-P209, 2012.
  4. I. Sung, H-J Kim, Chang Dong Yeo, “First observation on the feasibility of scratch formation by pad-particle mixture in CMP process”, Applied Surface Science 258, pp. 8298-8306, 2012. *This paper is featured at ADINA news, (http://www.adina.com/newsgH123.shtml).
  5. H-J Kim, J-C Yang, B U Yoon, H-D Lee, T Kim, “Nano-Scale Stick-Slip Friction Model for the Chatter Scratch Generated by Chemical Mechanical Polishing Process”, Journal of Nanoscience and Nanotechnolgy 12 pp.5683-5686, 2012.
  6. H-J Kim, “A study on the tribolayer using Focused Ion Beam(FIB)”, Journal of the Korean Society of Tribologists and Lubrication Engineering, Journal of KSTLE 26 (2), pp.122-128, 2010.
  7. H-J Kim, S. Karthikeyan, D.A. Rigney, “A simulation study of mixing, atomic flow and velocity profiles of crystalline materials during sliding”, Wear 267, pp.1130-1136, 2009.
  8. H-J Kim, A. Emge, R. Winter, P. Keightley, W-K. Kim, M. Falk, D.A. Rigney, “Nanostructures generated by explosively-driven friction - Experiments and MD simulations”, Acta Materialia 57, pp.5270-5282, 2009.
  9. H-J Kim, W-K Kim, M. Falk, D.A. Rigney, “MD simulations of microstructure evolution during high-velocity sliding between crystalline materials”, Tribology Letters 28, pp.299-306, 2007.
  10. H-J. Kim, W. Windl, D.A. Rigney, “Structure and chemical analysis of wear debris: experiments and ab-initio simulations”, Acta Materialia 55, pp.6489-6498, 2007.
  11. H-J. Kim, S. Karthikeyan, D.A. Rigney, “The structure and composition change of aluminum wear debris generated by unlubricated sliding”, Wear 263, pp.849-857, 2007.
  12. A. Emge, S. Karthikeyan, H-J. Kim, D. Rigney, “The effect of sliding velocity on the tribological behavior of copper”, Wear 263, pp.614-618, 2007.
  13. J.S. Shin, J.S. Bae, H.J. Kim, H.M. Lee, T.D. Lee, Laverina E.J, Z-H. Lee “Ordering-disordering phenomena and micro-hardness characteristics of B2 phase in Fe-(5-6.5%)Si alloys”, Materials Science and Engineering A, vol. 407, pp.282-290, 2005.
  14. S. Karthikeyan, H-J. Kim, and D.A. Rigney, “Velocity and strain-rate profiles in materials subjected to unlubricated sliding”, Physical Review Letters, vol. 95, 106001, 2005.
  15. H-J. Kim, A. Emge, S. Karthikeyan, D.A. Rigney, “Effects of tribo-oxidation on sliding behavior of aluminum”, Wear 259, pp.501-505, 2005.
  16. H.J. Kim, J.S. Bae, T.D. Lee and H.M. Lee, “Effect of sputtering condition and heat treatment in Co/Cu/Co/FeMn spin valve”, Journal of Magnetism and Magnetic Materials, vol. 241, no.2-3, pp.173-178, 2002.
  17. H.J. Kim, J.S. Bae, E.S. Noh, T.D. Lee and H.M. Lee, “Study on the improvement of exchange bias and magnetoresistance in Co/Cu/Co/FeMn spin valve by heat treatment”, Journal of the Korean Magnetics Society, vol.12, no.1, pp.24-29, 2002.
  18. H.J. Kim, J.S. Bae, E.S. Noh, Z.H. Lee, T.D. Lee and H.M. Lee, “Study on conditions of disappearance of ordered phase in high silicon steel by Transmission Electron Microscopy”, Journal of Korean Institute of Metals and Materials, vol.40, no.10, pp. 1023-1026, 2002.

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