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Biography

Prof. Achim Bittner

Vienna University of Technology, Austria


Email: Achim.Bittner@tuwien.ac.at


Qualifications

2009 Ph.D., Saarland University, Germany


Publications (Selected)

  1. LTCC-Dünnfilm-Polymer Kombination für 77-81 GHz Radarsysteme, D. Schwanke, T. Haas, M. Harnack, A. Bittner, E. Feurer, S. Hoyler, B. Holl, U. Schmid; VDE Kongress, 23.10.-25.10.; 2006; Aachen
  2. Local Modification of Fired LTCC Substrates for High Frequency Applications. A. Bittner, H. Seidel, U. Schmid, T. Haas, Advanced Microsystems for Automotive Applications 2008, VDI-Verlag, pp. 191-203, 2008.
  3. Study on the Microstructure of Silver Thin Films on LTCC. A. Bittner, T. Bohnenberger, B. Simon, H. Seidel, U. Schmid; 4th Conf. and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technology (CICMT), Munich, April 21-24, pp. 360-365; 2008.
  4. The porosification of fired LTCC substrates by applying a wet chemical etching procedure. A. Bittner, U. Schmid, J. Europ. Ceram. Soc., Vol. 29, pp. 99-104, 2009.
  5. Morphological and Electrical Properties of Silver Thin Films Sputter Deposited on LTCC Substrates. A. Bittner, T. Bohnenberger, R. Engel, H. Seidel, U. Schmid; J. Microelectronics and Electronic Packaging, Vol. 5, Iss. 4, 2008.
  6. High-Frequency Characterization of Porous Low-Temperature Cofired Ceramics Substrates. A. Bittner, H. Seidel, U. Schmid, J. Amer. Ceram. Soc., Vol. 9, pp. 3778-3781, 2010.
  7. RF MEMS switches based on an alloy of aluminum-silicon-copper. S. Klein, C. Comtesse, A. Bittner, H. Seidel, V. Ziegler, U. Prechtel und U. Schmid; Proc. SPIE-Konferenz, Smart Sensors, Actuators and MEMS”,Vol.7362, No. 73621D, 4.5.-6.5., Dresden, 2009.
  8. Influence of the crystal orientation on the electrical properties of AlN thin films on LTCC substrates. A. Bittner, A. Ababneh, H. Seidel und U. Schmid; Appl. Surf. Sci., Vol. 257, pp. 1088–1091, 2010.
  9. Electromigration resistance and long term stability of textured silver thin films on LTCC. A. Bittner, H. Seidel U. Schmid; Microelectron. Eng., Vol. 88, pp. 127-130, 2011.