MPT, Inc., Fullerton, CA, USA
MPT, Inc., Fullerton, CA, USA
Department of Electrical and Computer Engineering, Colorado State University, Fort Collins, CO, USA
Copyright © 2017 Rick Sturdivant, Astacian Bogdon, Edwin K. P. Chong et al. This is
an open access article distributed under the Creative Commons Attribution
License, which permits unrestricted use, distribution, and reproduction in any
medium, provided the original work is properly cited.
How to Cite this Article
Sturdivant, R. , Bogdon, A. and Chong, E. (2017) Balancing Thermal and Electrical Packaging Requirements for GaN Microwave and Millimeter-Wave High Power Amplifier Modules.
Journal of Electronics Cooling and Thermal Control,
7, 1-7. doi:
10.4236/jectc.2017.71001.