Department of Business Engineering, University of Rome “Tor Vergata”, Rome, Italy
Department of Business Engineering, University of Rome “Tor Vergata”, Rome, Italy
Department of Business Engineering, University of Rome “Tor Vergata”, Rome, Italy
Department of Business Engineering, University of Rome “Tor Vergata”, Rome, Italy
Copyright © 2013 A. Antenucci, S. Guarino, V. Tagliaferri, N. Ucciardello et al. This is
an open access article distributed under the Creative Commons Attribution
License, which permits unrestricted use, distribution, and reproduction in any
medium, provided the original work is properly cited.
How to Cite this Article
A. Antenucci, S. Guarino, V. Tagliaferri and N. Ucciardello, "Electro-Deposition of Cu on Open Cell Aluminum Foams,"
Materials Sciences and Applications, Vol. 4 No. 11, 2013, pp. 679-682. doi:
10.4236/msa.2013.411084.