Materials Sciences and Applications

Vol.3 No.3(2012), Paper ID 18058, 6 pages

DOI:10.4236/msa.2012.33024

 

Microstructure Evolution of W-Cu Alloy Wire

 

Fei Shao, Wenge Chen, Hui Zhang, Bingjun Ding

 

School of Materials Science and Engineering, Xi’an University of Technology, Xi’an, China
School of Materials Science and Engineering, Xi’an University of Technology, Xi’an, China
School of Materials Science and Engineering, Xi’an University of Technology, Xi’an, China
School of Science, Xi’an Jiaotong University, Xi’an, China

 

Copyright © 2012 Fei Shao, Wenge Chen, Hui Zhang, Bingjun Ding et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

 

How to Cite this Article


F. Shao, W. Chen, H. Zhang and B. Ding, "Microstructure Evolution of W-Cu Alloy Wire," Materials Sciences and Applications, Vol. 3 No. 3, 2012, pp. 157-162. doi: 10.4236/msa.2012.33024.

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