Materials Sciences and Applications

Vol.3 No.3(2012), Paper ID 18054, 8 pages

DOI:10.4236/msa.2012.33021

 

Through-Thickness Thermal Conductivity Prediction Study on Nanocomposites and Multiscale Composites

 

Michael Zimmer, Xinyu Fan, Jianwen Bao, Richard Liang, Ben Wang, Chuck Zhang, James Brooks

 

Florida State University, High-Performance Materials Institute, Tallahassee, USA
Florida State University, High-Performance Materials Institute, Tallahassee, USA
Florida State University, High-Performance Materials Institute, Tallahassee, USA
Florida State University, High-Performance Materials Institute, Tallahassee, USA
Florida State University, High-Performance Materials Institute, Tallahassee, USA
Florida State University, High-Performance Materials Institute, Tallahassee, USA
National High Fields Magnetic Laboratory, Tallahassee, USA

 

Copyright © 2012 Michael Zimmer, Xinyu Fan, Jianwen Bao, Richard Liang, Ben Wang, Chuck Zhang, James Brooks et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

 

How to Cite this Article


M. Zimmer, X. Fan, J. Bao, R. Liang, B. Wang, C. Zhang and J. Brooks, "Through-Thickness Thermal Conductivity Prediction Study on Nanocomposites and Multiscale Composites," Materials Sciences and Applications, Vol. 3 No. 3, 2012, pp. 131-138. doi: 10.4236/msa.2012.33021.

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