Share This Article:

Modelling of Al-Cu-Mg-Fe-Ni Aluminium Alloy

Abstract Full-Text HTML Download Download as PDF (Size:413KB) PP. 79-81
DOI: 10.4236/ojmetal.2012.24012    2,811 Downloads   6,670 Views   Citations

ABSTRACT

Hot deformation characteristics of Al-Cu-Mg-Fe-Ni aluminium alloy have been studied in the temperature range 350°C - 450°C and strain rate range 0.001 - 0.4 s-1 using hot compression tests. The experimental results were used to develop a model for predicting the material characteristics during hot deformation. A series of plane-strain compression (PSC) tests were carried out at 950°C and a strain rate of 0.1, 1 and 10 s-1 to several strain levels.

Conflicts of Interest

The authors declare no conflicts of interest.

Cite this paper

D. Suker, "Modelling of Al-Cu-Mg-Fe-Ni Aluminium Alloy," Open Journal of Metal, Vol. 2 No. 4, 2012, pp. 79-81. doi: 10.4236/ojmetal.2012.24012.

References

[1] M. Zhou, D. Shu, L. Li and W. Y.Zhang, “Performance Improvement of Industrial Pure Aluminum Treated by Stirring Molten Fluxes,”Materials Science and Engineering, Vol. 347, No. 1-2, 2003, pp. 280-290.
[2] M. S. Loveday, G. J. Mahon, B. Roebuck, A. J. Lacey, E. J. Palmiere, C. M. Sellars and M. R. van der Winden, “Measurement of Flow Stress in Hot Plane Strain Compression Tests,” Materials at High Temperatures, Vol. 23, No. 2, 2006, pp. 85-118. doi:10.3184/096034006782739394
[3] H. Shi, A. J. McLaren, C. M. Sellars, R. Shahani and R. Bolingbroke, “Constitutive Equations for High Temperature Flow Stress of Aluminium Alloys,” Materials Science and Technology, Vol. 13, No. 3, 1979, pp. 210-216. doi:10.1179/026708397790302421
[4] M. S. Mirza and C. M. Sellars, “Multipass Rolling of Aluminium Alloys: Finite Element Simulations and Microstructural Evolution,” Materials Science and Technology, Vol. 17, No. 7, 2001, pp. 1133-1141. doi:10.1179/026708301101510663
[5] B. Kowalski, A. J. Lacey and C. M. Sellars, “Correction of Plane Strain Compression Data for the Effects of Inhomogeneous Deformation,” Materials Science and Technology, Vol. 19, No. 11, 2003, pp. 1564-1570. doi:10.1179/026708303225008130

  
comments powered by Disqus

Copyright © 2019 by authors and Scientific Research Publishing Inc.

Creative Commons License

This work and the related PDF file are licensed under a Creative Commons Attribution 4.0 International License.