[1]
|
G. Warnecke and U. Zitt, “Kinematic simulation for analyzing and predicting high-performance grinding processes,” Annals of CIRP, Vol. 47, No. 1, pp. 265-270, 1998.
|
[2]
|
B. Varghese, S. Pa. Hare, R. Gao, C. Guo and S. Malkin, “Development of a sensor-integrated ‘Intelligent’ grinding wheel for in-process monitoring,” Annals of the CIRP Vol. 49, No. 1, pp. 265-270, 2000.
|
[3]
|
C. Koepfer, “What is single point OD grinding,” Modern Machine Shop, Vol. 7, No. 70, pp. 62-99, 1997.
|
[4]
|
L. Zhou, J. Shimizu, A. Muroya, et al., “Material removal mechanism beyond plastic wave propagation rate,” Precision Engineering, Vol. 27, pp. 109-116, 2003.
|
[5]
|
H. K. T?nshoff, T. Friemuth and J. C. Becker, “Process monitoring in grinding,” Annals of the CIRP, Vol. 51, No. 2, pp. 551-569, 2002.
|
[6]
|
T. Jin and G. Q. Cai, “Analytical thermal models of oblique moving heat source plane for deep grinding and cutting,” Journal of Manufacturing Science and Engineering, American Society of Mechanical Engineers, Vol. 123, No. 1, pp. 185-190, 2001.
|
[7]
|
H. H. Zhao, B. F. Feng and G. Q. Cai, “Study of ultra- high speed grinding mechanism with molecular dynamics simulation,” Key Engineering Materials, Vol. 259-260, pp. 302-306, 2004.
|
[8]
|
B. Lin, H. Wu, H. T. Zhu and S. Y. Yu, “Study on mechanism for material removal and surface generation by molecular dynamics simulation in abrasive processes,” Key Engineering Materials, Vol. 259-260, pp. 211-215, 2004.
|
[9]
|
G. Warnecke and U. Zitt, “Kinematic simulation for analyzing and predicting high-performance grinding processes,” Annals of CIRP, Vol. 47, No. 1, pp. 265-270, 1998.
|
[10]
|
W. B. Rowe, Y. Li, X. Chen and B. Mills, “An intelligent multiagent approach for selection of grinding conditions,” Annals of the CIRP, Vol. 46, No. 1, 233-238, 1997.
|
[11]
|
J. F. G. de Oliveira and D. A. Dornfeld, “Application of AE contact sensing in reliable grinding monitoring,” Annals of the CIRP, Vol. 50, No. 1, pp. 217-220, 2001.
|
[12]
|
S. C. Aurich, O. Braun and G. Warnecke, “Development of a superabrasive grinding wheel with defined grain structure using kinematic simulation,” Annals of the CIRP, Vol. 52, No. 1, pp. 275-280, 2003.
|
[13]
|
H. K. T?nshoff, B. Karpuschewski and T. Mandrysch, “Grinding process achievements and their consequences on machine tools challenges and opportunities,” Annals of the CIRP, Vol. 47, No. 2, pp. 651-668, 1998.
|
[14]
|
H. Huang and T. C. Liu, “Experimental investigations of machining characteristics and removal mechanisms of advanced ceramics in high speed deep grinding,” International Journal of Machine Tools & Manufacture, Vol. 43, No. 8, pp. 811-823, 2003.
|
[15]
|
F. Klocke, E. Brinksmeier, C. Evans, et al., “High-speed grinding-fundaments and state of the art in Europe, Japan and the USA,” Annals of the CIRP, Vol. 46, No. 2, pp. 715-724, 1997.
|
[16]
|
J. F. G. Oliveira and C. M. O. Valente, “Fast grinding process control with AE modulated power signals,” Annals of the CIRP, Vol. 53, No. 1, 2004.
|
[17]
|
X. P. Xu, H. Huang and W. M. Zeng, “Thermal study on the grinding of granite with superabrasive tools,” Diamond and Abrasives Engineering, Vol. 3, pp. 12-17, 2003.
|
[18]
|
Sunarto and Y. Ichida, “Creep feed profile grinding of Ni-based superalloys with ultrafine-polycrystalline CBN abrasive grits,” Precision Engineering, Vol. 25, pp. 274- 283, 2000.
|
[19]
|
X. P. Xu, Y. Q. Yu and H. J. Xu, “Effect of grinding temperature on the surface integrity of a nickel-based superalloy,” Journal of Materials Processing Technology, Vol. 129, pp. 359-363, 2002.
|
[20]
|
T. W. Hwang, C. J. Evans and S. Malkin, “An investigation of high speed grinding with electroplated diamond wheels,” Annals of the CIRP, Vol. 49, No. 1, pp. 245-248, 2000.
|