Effect of Conduction Pre-heating in Au-Al Thermosonic Wire Bonding

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Journal of Surface Engineered Materials and Advanced Technology

ISSN Print: 2161-4881
ISSN Online: 2161-489X
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"Effect of Conduction Pre-heating in Au-Al Thermosonic Wire Bonding"
written by Gurbinder Singh, Othman Mamat,
published by Journal of Surface Engineered Materials and Advanced Technology, Vol.1 No.3, 2011

has been cited by the following article(s):

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CrossRef

[1]	Implementation of a Temperature Ramp Rate Requirement and Impact on the Packaging Processes
	2018

[2]	Progress in ultrasonic bonding wire process and quality evaluation of bonding point
	Proceedings Volume 10462, AOPC 2017: Optical Sensing and Imaging Technology and Applications, 2017

[3]	Resonant Tunnelling Diodes for Millimetre and Sub-Millimetre Wave Mixing Applications
	2016

[4]	Thermal Analysis of Heating System in Thermosonic Bonding Process
	Applied Mechanics and Materials, 2013

[1]	Implementation of a Temperature Ramp Rate Requirement and Impact on the Packaging Processes International Symposium on Microelectronics, 2018 DOI:10.4071/2380-4505-2018.1.000494

[2]	Progress in ultrasonic bonding wire process and quality evaluation of bonding point AOPC 2017: Optical Sensing and Imaging Technology and Applications, 2017 DOI:10.1117/12.2285650

[3]	Thermal Analysis of Heating System in Thermosonic Bonding Process Applied Mechanics and Materials, 2013 DOI:10.4028/www.scientific.net/AMM.300-301.794

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