Evaluation of Fatigue Life of Semiconductor Power Device by Power Cycle Test and Thermal Cycle Test Using Finite Element Analysis

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"Evaluation of Fatigue Life of Semiconductor Power Device by Power Cycle Test and Thermal Cycle Test Using Finite Element Analysis"
written by Kazunori Shinohara, Qiang Yu,
published by Engineering, Vol.2 No.12, 2010

has been cited by the following article(s):

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[1]	Investigation on Reliability of Power Devices by Finite Element Analysis
	2022 23rd …, 2022

[2]	Thermo-mechanical Analysis and Fatigue Life Prediction for Integrated Circuits (ICs)
	… on Circuits and …, 2021

[3]	Thermal-Mechanical FE Analysis of IGBT Module with Different Power Terminal Shape
	2020

[4]	Effect of solder material thickness on Power MOSFET reliability by Electro-thermo-Mechanical Simulations
	Microelectronics Reliability, 2018

[5]	Development of thermal shock-resistant of GaN/DBC die-attached module by using Ag sinter paste and thermal stress relaxation structure
	Microelectronics Reliability, 2018

[6]	Mission profile-based accelerated ageing tests Of SiC MOSFET And Si IGBT Power Modules In DC/AC Photovoltaic Inverters
	Thesis, 2018

[7]	Vieillissement accéléré de modules de puissance de type MOSFET SiC et IGBT Si basé sur l'analyse de profils de mission d'onduleurs photovoltaïques.
	Thèse, 2018

[8]	FE analysis the effect of bonding wire and solder failure on the resistance and temperature of IGBT
	2018

[9]	Power cycle tests of high temperature Ag sinter die-attach on metalized ceramic substrate by using micro-heater SiC chip
	2018

[10]	Numerical Fatigue Life Prediction of IGBT Module for Electronic Locomotive
	2017

[11]	수치해석을 이용한 전동차용 IGBT 모듈의 피로 수명 예측
	2017

[12]	Electro-thermal and thermal-mechanical FE analysis of IGBT module with different bonding wire shape
	2017

[13]	Predicting LED System Life: A Long-term Study of the Factors that Determine Performance and Failure
	2017

[14]	Projecting LED product life based on application
	2016

[15]	Power Cycling Reliability of Power Module: A Survey
	IEEE Transactions on Device and Materials Reliability, 2016

[16]	Numerical Prediction of Solder Fatigue Life in a High Power IGBT Module Using Ribbon Bonding
	Journal of Power Electronics, to be Published, 2016

[17]	A Probabilistic Approach for Reliability and Life Prediction of Electronics in Drilling and Evaluation Tools
	Kale, Amit A., Katrina Carter-Journet, Troy A. Falgout, Ludger Heuermann-Kuehn, and Derick Zurcher., 2014

[18]	Application of nonlinear fatigue damage models in power electronic module wirebond structure under various amplitude loadings
	Advances in Manufacturing, Springer, 2014

[19]	パワー半導体モジュールのマルチフィジックスシミュレーション
	大同大学紀要= Bulletin of Daido University, 2013

[20]	アイテムリスト
	2013

[21]	Thermo-elastic-plastic analysis for elastic component under high temperature fatigue crack growth rate
	ProQuest Dissertations Publishing, 2013

[22]	Thermo-elastic-plastic analysis for elastic component under high temperature fatigue crack growth rate.
	2013

[1]	Finite Elements Analysis of LED's Solder Joints During Power Thermal Cycling 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), 2022 DOI:10.1109/ESTC55720.2022.9939493

[2]	Thermal-Mechanical FE Analysis of IGBT Module with Different Power Terminal Shape 2020 21st International Conference on Electronic Packaging Technology (ICEPT), 2020 DOI:10.1109/ICEPT50128.2020.9202631

[3]	FE analysis the effect of bonding wire and solder failure on the resistance and temperature of IGBT 2018 19th International Conference on Electronic Packaging Technology (ICEPT), 2018 DOI:10.1109/ICEPT.2018.8480581

[4]	Development of thermal shock-resistant of GaN/DBC die-attached module by using Ag sinter paste and thermal stress relaxation structure Microelectronics Reliability, 2018 DOI:10.1016/j.microrel.2018.07.044

[5]	Effect of solder material thickness on Power MOSFET reliability by Electro-thermo-Mechanical Simulations Microelectronics Reliability, 2018 DOI:10.1016/j.microrel.2018.07.082

[6]	Power cycle tests of high temperature Ag sinter die-attach on metalized ceramic substrate by using micro-heater SiC chip International Symposium on Microelectronics, 2018 DOI:10.4071/2380-4505-2018.1.000084

[7]	Electro-thermal and thermal-mechanical FE analysis of IGBT module with different bonding wire shape 2017 18th International Conference on Electronic Packaging Technology (ICEPT), 2017 DOI:10.1109/ICEPT.2017.8046514

[8]	Power Cycling Reliability of Power Module: A Survey IEEE Transactions on Device and Materials Reliability, 2016 DOI:10.1109/TDMR.2016.2516044

[9]	Numerical Prediction of Solder Fatigue Life in a High Power IGBT Module Using Ribbon Bonding Journal of Power Electronics, 2016 DOI:10.6113/JPE.2016.16.5.1843

[10]	Projecting LED product life based on application Fifteenth International Conference on Solid State Lighting and LED-based Illumination Systems, 2016 DOI:10.1117/12.2240464

[11]	Application of nonlinear fatigue damage models in power electronic module wirebond structure under various amplitude loadings Advances in Manufacturing, 2014 DOI:10.1007/s40436-014-0054-5

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