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Air Cooling of Mini-Channel Heat Sink in Electronic Devices

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DOI: 10.4236/jectc.2013.32007    5,840 Downloads   10,843 Views   Citations

ABSTRACT

Heat transfer experiments were conducted to investigate the thermal performance of air cooling through mini-channel heat sink with various configurations. Two types of channels have been used, one has a rectangular cross section area of 5 × 18 mm2 and the other is triangular with dimension of 5 × 9 mm2. Four channels of each configuration have been etched on copper block of 40 mm width,30 mm height, and 200 mm length. The measurements were performed in steady state with air flow rates of 0.002 - 0.005 m3/s, heating powers of 80 - 200 W and channel base temperatures of 48°C, 51°C, 55°C and 60°C. The results showed that the heat transfer to air stream is increased with increasing both of air mass flow rate and channel base temperature. The rectangular channels have better thermal performance than trian- gular ones at the same conditions. Analytical fin approach of 1-D and 2-D model were used to predict the heat transfer rate and outlet air temperature from channels heat sink. Theoretical results have been compared with experimental data. The predicted values for outlet air temperatures using the two models agree well with a deviation less than ±10%. But for the heat transfer data, the deviation is about +30% to –60% for 1-D model, and –5% to –80% for 2-D model. The global Nusselt number of the present experimental data is empirically correlated as with accuracy of ±20% for and compared with other literature correlations.

Conflicts of Interest

The authors declare no conflicts of interest.

Cite this paper

Mohamed, M. and El-Baky, M. (2013) Air Cooling of Mini-Channel Heat Sink in Electronic Devices. Journal of Electronics Cooling and Thermal Control, 3, 49-57. doi: 10.4236/jectc.2013.32007.

References

[1] Jinliang X., Jijun Z. and Yunhua G., “Static and Dynamic Flow Instability of a Parallel Micro-Channel Heat Sink at High Heat Fluxes,” Energy Conversion and Management, Vol. 46, No. 2, 2005, pp. 313-334. doi:10.1016/j.enconman.2004.02.012
[2] M. J. Kohl, et al., “An Experimental Investigation of Microchannel Flow with Internal Pressure Measurements,” International Journal of Heat and Mass Transfer, Vol. 48, No. 8, 2005, pp. 1518-1533. doi:10.1016/j.ijheatmasstransfer.2004.10.030
[3] D. B. Tuckerman and R. F. W. Pease, “High Performance Heat Sinking for VLSI,” IEEE Electron Device Letters, Vol. 2, No. 5, 1981, pp. 126-129. doi:10.1109/EDL.1981.25367
[4] D. B. Tuckerman and R. F. Pease, “Ultrahigh Thermal Conductance Microstructures for Integrated Circuits,” Proceedings of the 32nd IEEE Electronics Components Conference, 1982, pp. 145-149.
[5] R. J. Philips, “Micro-Channel Heat Sinks,” In: A. Bar-Cohen and A. D. Kraus, Eds., Advances in Thermal Modeling of Electronic Components and System, ASME, New York, 1990, Chapter 3.
[6] G. Hetsroni, et al., “A Uniform Temperature Heat Sink for Cooling of Electronic Devices,” International Journal of Heat and Mass Transfer, Vol. 45, No. 16, 2002, pp. 3275-3286. doi:10.1016/S0017-9310(02)00048-0
[7] Y. Cai, M. W. Wamdsganss and J. A. Jendrzejczyk, “Application of Chaos Theory in Identification of Two Phase Flow Patterns and Transitions in a Small, Horizontal, Rectangular Channel,” Journal of Fluids Engineering— ASME, Vol. 118, No. 2, 1996, pp. 383-390. doi:10.1115/1.2817390
[8] Y. P. Peles, L. P. Yarin and G. J. Hetsroni, “Steady and Unsteady Flow in a Heated Capillary,” International Journal of Multiphase Flow, Vol. 27, No. 4, 2001, pp. 577-598. doi:10.1016/S0301-9322(00)00041-0
[9] D. Brutin, F. Topin and L. Tadrist, “Experimental Study of Unsteady Convective Boiling in Heated Mini-Channels,” International Journal of Heat and Mass Transfer, Vol. 46, No. 16, 2003, pp. 2957-2965. doi:10.1016/S0017-9310(03)00093-0
[10] H. Y. Wu and P. Chenh, “Visualization and Measurements of Periodic Boiling in Silicon Microchannels,” International Journal of Heat and Mass Transfer, Vol. 46, No. 14, 2003, pp. 2603-2614. doi:10.1016/S0017-9310(03)00039-5
[11] W. L. Qu and I. Mudawar, “Flow Boiling Heat Transfer in Two Phase Micro-Channel Heat Sinks-I, Experimental Investigation and Assessment of Correlations Methods,” International Journal of Heat and Mass Transfer, Vol. 46, No. 15, 2003, pp. 2755-2771. doi:10.1016/S0017-9310(03)00041-3
[12] S. F. Wang, R. Mosdorf and M. Shoji, “Nonlinear Analysis on Fluctuation of Two Phase Flow through a T-Junction,” International Journal of Heat and Mass Transfer, Vol. 46, No. 9, 2003, pp. 1519-1528. doi:10.1016/S0017-9310(02)00455-6
[13] L. J. Missaggiaand and J. N. Walpole, “A Microchannel Heat Sink with Alternating Directions of Water Flow in Adjacent Channels,” Integrated Optoelectronics for Communication and Processing, Vol. 1582, 1992, pp. 106-111. doi:10.1117/12.135008
[14] K. Vafai and Z. Lu, “Analysis of Two-Layered Microchannel Heat Sink Concept in Electronic Cooling,” International Journal of Heat and Mass Transfer, Vol. 42, No. 12, 1999, pp. 2287-2297. doi:10.1016/S0017-9310(98)00017-9
[15] X. Yin and H. H. Bau, “Uniform Channel Micro Heat Exchangers,” Journal of Electronics Packaging, Vol. 119, No. 2, 1997, pp. 89-94. doi:10.1115/1.2792225
[16] C. Yang, D. Q. Li and J. H. Masliyah, “Modeling Forced Liquid Convection in Rectangular Microchannels with Electro-Kinetic Effects,” International Journal of Heat and Mass Transfer, Vol. 41, No. 24, 1998, pp. 4229-4249. doi:10.1016/S0017-9310(98)00125-2
[17] S. F. Choquette, M. Faghri, M. Charmchi and Y. Asako, “Optimum Design of Microchannel Heat Sinks,” Microelectro-Mechanical Systems DSC, Vol. 59, 1996, pp. 115-126.
[18] S. H. Chong, K. T. Ooi and T. N. Wong, “Optimization of Single and Double Layer Counter Flow Microchannel Heat Sinks,” Applied Thermal Engineering, Vol. 22, No. 14, 2002, pp. 1569-1585. doi:10.1016/S1359-4311(02)00083-2
[19] J. H. Ryu, D. H. Choi and S. J. Kim, “Numerical Optimization of the Thermal Performance of a Microchannel Heat Sink,” International Journal of Heat and Mass Transfer, Vol. 45, No. 13, 2002, pp. 2823-2827. doi:10.1016/S0017-9310(02)00006-6
[20] J. Y. Min, S. P. Jang and S. J. Kim, “Effect of Tip Clearance on the Cooling Performance of a Microchannel Heat Sink,” International Journal of Heat and Mass Transfer, Vol. 47, No. 5, 2004, pp. 1099-1103. doi:10.1016/j.ijheatmasstransfer.2003.08.020
[21] C. Y. Zhao and T. J. Lu, “Analysis of Micro-Channel Heat Sinks for Electronics Cooling,” International Journal of Heat and Mass Transfer, Vol. 45, No. 24, 2002, pp. 4857-4869. doi:10.1016/S0017-9310(02)00180-1
[22] S. J. Kim, D. Kim and D. Y. Lee, “On the Local Thermal Equilibrium in Microchannel Heat Sinks,” International Journal of Heat and Mass Transfer, Vol. 43, No. 10, 2000, pp. 1735-1748. doi:10.1016/S0017-9310(99)00259-8
[23] S. J. Kim and D. Kim, “Forced Convection in Microstructures for Electronic Equipment Cooling,” Journal of Heat Transfer—ASME, Vol. 121, No. 3, 1999, pp. 635-645. doi:10.1115/1.2826027
[24] M, M. Mohamed, “Air Cooling Characteristics of a Uniform Square modules Array for Electronic Device Heat Sink,” Applied Thermal Engineering, Vol. 26, No. 5-6, 2006, pp. 486-493. doi:10.1016/j.applthermaleng.2005.07.013
[25] M. Beriache, A. Bettahar, H. Naji, L. Loukarfi and L. Mokhtar Saidia, “Fluid Flow and Thermal Characteristics of a Mini Channel Heat Sink with Impinging Air Flow,” Arabian Journal for Science and Engineering, Vol. 37, No. 8, 2012, pp. 2243-2254. doi:10.1007/s13369-012-0321-3
[26] X. L. Xie, W. Q. Tao and Y. L. He, “Numerical Study of Turbulent Heat Transfer and Pressure Drop Characteristics in a Water-Cooled Mini channel Heat Sink,” Journal of Electronic Packaging, Vol. 129, No. 3, 2007, pp. 247-255. doi:10.1115/1.2753887
[27] F. P. Incropera and D. P. DeWitt, “Fundamentals of Heat and Mass Transfer,” Fourth Edition, John Wiley, New York, 1996.
[28] R. W. Knight, J. S. Goodling and D. J. Hall, “Optimal Thermal Design of Forced Convection Heat Sinks-Analytical,” Journal of Electronic Packaging—ASME, Vol. 113, No. 3, 1991, pp. 313-321. doi:10.1115/1.2905412
[29] J. P. Holman, “Heat Transfer,” McGraw-Hill Book Company, New York, 1989.

  
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