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J. Maity, T. K. Pal and R. Maiti, “Transient Liquid Phase Diffusion Bonding of 6061-15 wt% SiCp in Argon Environment,” Journal of Materials Processing Technology, Vol. 209, No. 7, 2009, pp. 3568-3580. doi:10.1016/j.jmatprotec.2008.08.015

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