H. W. Miao and J. G. Duh, “Microstructural Evolution in Sn-Bi and Sn-Bi-Cu Solder Joints Under Thermal Aging,” Materials Chemistry and Physics, Vol. 71, No. 3, 2001, pp. 255-271. doi:10.1016/S0254-0584(01)00298-X

has been cited by the following article:

• TITLE: Effect of Antimony Additions on Corrosion and Mechanical Properties of Sn-Bi Eutectic Lead-Free Solder Alloy

  AUTHORS: Alberto Torres, Luis Hernández, Octavio Domínguez

  KEYWORDS: Lead Free Solder Alloys; Sn-Bi-Sb; Mechanical Properties; Corrosion Properties

  JOURNAL NAME: Materials Sciences and Applications, Vol.3 No.6, June 18, 2012

  ABSTRACT: The goal of the present work is to investigate the effects of the addition of Sb (0, 3 and 6 wt%) on structure, melting, corrosion and mechanical properties of Sn-Bi eutectic solder alloys. The mechanical properties of the bulk Sn-Bi-Sb solders were higher as the amount of antimony increases, making compressive strength augment from 65 MPa to 100 MPa when 6 wt% Sb was incorporated to the Sn-Bi eutectic alloy. The three alloys presented a melting temperature that is smaller to the one exhibited by the eutectic alloy Sn-38Pb (Tm = 183°C). According to the electrochemical results, the addition of higher contents of Sb to the Sn-Bi eutectic alloy had a positive effect: it ennobled the Ecorr values.