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C. W. Hwang and K. Suganuma, “Joint Reliability and High Temperature Stability of Sn-Ag-Bi Lead-Free Solder with Cu and Sn-Pb/Ni/Cu Substrates,” Materials Science and Engineering, Vol. 373, No. 1-2, 2004, pp. 187-194. doi:10.1016/j.msea.2004.01.019

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