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Hwang, P.-W., Cheng, H.-C., Fang, J. and Li, J.-H. (2007) CFD-Based Thermal Characterization of Board-Level Microelectronic Devices under Natural Convection Cooling. 2007 International Microsystems, Packaging, Assembly and Circuits Technology, Taipei, 1-3 October 2007, 79-82.
https://doi.org/10.1109/IMPACT.2007.4433572
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