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Mostafa Shalaby, R., Kamal, M., Ali, E.A.M. and Gumaan, M.S. (2017) Microstructural and Mechanical Characterization of Melt Spun Process Sn-3.5Ag and Sn-3.5Ag-xCu Lead-Free Solders for Low Cost Electronic Assembly. Materials Science and Engineering: A, 690, 446-452.
https://doi.org/10.1016/j.msea.2017.03.022

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